Packaging Engineer

AMD
Taiwan
Workplace: HybridFull timeFunction: Industrial, Process & Manufacturing EngineeringEducation: mastersSkills: ["Self-motivated","Independent work","Communication"]

Lead assembly technology development with OSAT and foundry partners, and drive broader industry technology development to meet future requirements. Collaborate with integration and design teams to align assembly and design needs, and create plans to enhance assembly capabilities. Establish ecosystem partners to define an assembly capability improvement roadmap. Apply advanced packaging process knowledge and hands-on experience in large module/die assembly, chip-on-wafer/panel, and chip-on-substrate challenges.

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FursaFursa
AMD
AMD
1 month ago

Packaging Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 11 hours agoStatus: Live

Job Summary

Lead assembly technology development with OSAT and foundry partners, and drive broader industry technology development to meet future requirements. Collaborate with integration and design teams to align assembly and design needs, and create plans to enhance assembly capabilities. Establish ecosystem partners to define an assembly capability improvement roadmap. Apply advanced packaging process knowledge and hands-on experience in large module/die assembly, chip-on-wafer/panel, and chip-on-substrate challenges.
Location: Taiwan
Workplace: Hybrid
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Lead OSAT-led development of advanced assembly technology capabilities to meet technology development deliverables.
  • •Collaborate with integration and design teams to integrate assembly and design requirements.
  • •Formulate plans to enhance assembly capabilities to meet design needs.
  • •Establish ecosystem partners to identify an assembly capability improvement roadmap.

Key Requirements

  • •In-depth process knowledge of key advanced packaging processes.
  • •Hands-on experience with large module/die assembly challenges, including chip on wafer/panel and chip on substrate.
  • •Experience using technology development tools such as FMEA, SPC, and control plans.
  • •Strong communication skills in both English and Chinese.
  • •Minimum Msc in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent.
Experience:Advanced packaging
Education:Master's in Mechanical Engineering, Electrical Engineering, Materials Science, Physics
Skills:Self-motivatedIndependent workCommunication
Languages:EnglishChinese
Tech Stack:OSATFMEASPCControl plans

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn