Packaging Module Development Engineer

Intel
United States
Full timeFunction: Product ManagementSkills: []

Develop packaging modules supporting Intel’s engineering programs in the Phoenix area, working with cross-functional teams to deliver design and development efforts.

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Intel
Intel
1 day ago

Packaging Module Development Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 3 hours agoStatus: Live

Job Summary

Develop packaging modules supporting Intel’s engineering programs in the Phoenix area, working with cross-functional teams to deliver design and development efforts.
Location: United States
Employment Type: Full time
Job Function: Product Management

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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