Mechanical Engineering | Physics internship: wafer flatness optimization

Join ASML’s Tables & Clamps Analysis group in Veldhoven for a 6-month master internship focused on modeling and optimization of wafer tables to improve wafer flatness at nanometer precision. You’ll conduct literature reviews, enhance numerical models, define optimization objectives, apply adjoint-based methods, and validate results, supporting high-precision lithography systems while developing a user-friendly tool for engineers.