Applied Materials

2 months ago

CMP Module Process Engineer IV - (E4)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Serve as a CMP technical expert supporting wafer-fab customers across process, yield, and integration. Use data analytics to diagnose complex issues and drive continuous improvement projects that reduce defects/variability and improve Cpk and output. Lead customer discussions around high value problems, demonstrate service technologies (FabVantage) via onsite evaluations and demos, resolve tool issues with systematic troubleshooting, and mentor junior process engineers.

Location: Boise

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Perform complex analysis to identify, troubleshoot, and solve CMP process, yield, and integration problems.
•Lead customer discussions to understand high value problems, propose and implement continuous improvement projects, and improve customer KPIs.
•Increase CSA value through defect/variability/COO reduction and PM/process Cpk/matching/output optimization.
•Demonstrate and drive adoption of FabVantage offerings via demos, onsite evaluations, and joint development programs.
•Mentor and lead junior-level MPEs and contribute to the CMP network of experts and community of practice.

Travel: Medium travel

Pay and Benefits

Salary: USD 116,000 - 159,500 annually

Key Requirements

•10+ years’ experience in Chemical Mechanical Planarization (CMP) process with strong wafer fab background.
•10+ years of wafer fab process/equipment experience.
•Data analytics background to analyze, troubleshoot, and solve complex CMP process, yield, and integration problems.
•BS in Engineering.
•Demonstrated communication skills to present at senior levels and adoption of solutions; regarded as CMP unit process technical expert.

Experience:10+ yearsSemiconductor manufacturingWafer fabricationElectronics manufacturing

Education:Bachelor's in Engineering

Skills:CommunicationMentoringProblem-solvingAnalytical thinkingLeadership

Tech Stack:Chemical Mechanical Planarization (CMP)Wafer FabFabVantageFV360BOMECFSSCpk

Company Brief

Applied Materials

Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor

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Applied Materials

2 months ago

CMP Module Process Engineer IV - (E4)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Location: Boise

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Perform complex analysis to identify, troubleshoot, and solve CMP process, yield, and integration problems.
•Lead customer discussions to understand high value problems, propose and implement continuous improvement projects, and improve customer KPIs.
•Increase CSA value through defect/variability/COO reduction and PM/process Cpk/matching/output optimization.
•Demonstrate and drive adoption of FabVantage offerings via demos, onsite evaluations, and joint development programs.
•Mentor and lead junior-level MPEs and contribute to the CMP network of experts and community of practice.

Travel: Medium travel

Pay and Benefits

Salary: USD 116,000 - 159,500 annually

Key Requirements

•10+ years’ experience in Chemical Mechanical Planarization (CMP) process with strong wafer fab background.
•10+ years of wafer fab process/equipment experience.
•Data analytics background to analyze, troubleshoot, and solve complex CMP process, yield, and integration problems.
•BS in Engineering.
•Demonstrated communication skills to present at senior levels and adoption of solutions; regarded as CMP unit process technical expert.

Experience:10+ yearsSemiconductor manufacturingWafer fabricationElectronics manufacturing

Education:Bachelor's in Engineering

Skills:CommunicationMentoringProblem-solvingAnalytical thinkingLeadership

Tech Stack:Chemical Mechanical Planarization (CMP)Wafer FabFabVantageFV360BOMECFSSCpk

Company Brief

Applied Materials

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor