Packaging Engineer

AMD
Singapore
Workplace: OnsiteFull timeSGD 112,700 - 161,000 annuallyFunction: Hardware, Embedded & Systems EngineeringEducation: bachelorsSkills: ["Ownership","Accountability","Collaboration","Communication","Engineering excellence"]

Lead end-to-end package design execution for complex AMD advanced packaging products, driving performance, cost, quality, and schedule across multiple concurrent programs. Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D and chiplet-based architectures, while partnering closely with SI/PI, mechanical, SOC teams, OSATs, and substrate suppliers. Define and improve package design methodologies, improve layout efficiency and reuse, and mentor junior engineers through design reviews and tapeout readiness.

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FursaFursa
AMD
AMD
1 week ago

Packaging Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live

Job Summary

Lead end-to-end package design execution for complex AMD advanced packaging products, driving performance, cost, quality, and schedule across multiple concurrent programs. Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D and chiplet-based architectures, while partnering closely with SI/PI, mechanical, SOC teams, OSATs, and substrate suppliers. Define and improve package design methodologies, improve layout efficiency and reuse, and mentor junior engineers through design reviews and tapeout readiness.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

  • •Lead end-to-end package design execution for complex products and meet performance, cost, quality, and schedule targets.
  • •Handle multiple concurrent design programs in fast-paced, high-pressure environments.
  • •Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures).
  • •Drive design decisions through collaboration with SI/PI, mechanical, and SOC teams.
  • •Define and enhance package design methodologies and mentor junior engineers through reviews and tapeout readiness.

Pay and Benefits

Salary: SGD 112,700 - 161,000 annually

Key Requirements

  • •Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field.
  • •Demonstrate strong ownership and accountability across multiple concurrent programs.
  • •Apply AI/ML and automation to improve package design productivity and quality.
  • •Operate with minimal supervision while influencing cross-functional teams.
  • •Experience designing complex substrate design, Silicon Bridge, or interposers in advanced packaging environments.
Experience:Advanced packagingHeterogeneous integrationChiplet-based architectures
Education:Bachelor's in Electrical Engineering, Computer Engineering, or related field
Skills:OwnershipAccountabilityCollaborationCommunicationEngineering excellence
Languages:En-us
Tech Stack:AI/MLAutomationEDA toolsSignal integrityPower integrity

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn