IC Package Development Engineer

Micron Technology
Hyderabad
Workplace: OnsiteFull timeFunction: Product ManagementEducation: mastersSkills: ["Ownership","Learning agility","Disciplined execution","Clear communication","Collaboration"]

Develop and engineer semiconductor/memory IC package solutions from concept through qualification and manufacturing readiness. Perform package feasibility studies, architecture evaluations, and technical risk assessments using mechanical, electrical, materials, thermal, and manufacturing fundamentals. Create and validate package layouts, substrate structures, stack-ups, and design deliverables with CAD/EDA tools. Build automation and AI/ML models to accelerate design validation and detection of anomalies, while collaborating across global engineering and manufacturing teams.

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Micron Technology
Micron Technology
2 weeks ago

IC Package Development Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 3 hours agoStatus: Live

Job Summary

Develop and engineer semiconductor/memory IC package solutions from concept through qualification and manufacturing readiness. Perform package feasibility studies, architecture evaluations, and technical risk assessments using mechanical, electrical, materials, thermal, and manufacturing fundamentals. Create and validate package layouts, substrate structures, stack-ups, and design deliverables with CAD/EDA tools. Build automation and AI/ML models to accelerate design validation and detection of anomalies, while collaborating across global engineering and manufacturing teams.
Location: Hyderabad
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management

Key Responsibilities

  • •Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments across mechanical, electrical, materials, thermal, and manufacturing fundamentals.
  • •Contribute to memory and semiconductor package technology development from concept through qualification and manufacturing readiness, analyzing engineering data and documenting risks and recommendations.
  • •Design, create, review, or analyze package layouts, substrate structures, stack-ups, and drawings; develop engineering deliverables using CAD/EDA tools for routing, validation, documentation, and release.
  • •Develop automation and AI/ML capabilities for repetitive design, simulation, data-processing, validation, reporting, and workflow improvements, including copilots/assistants and dashboards.
  • •Partner with global multidisciplinary teams to resolve design, manufacturability, performance, and data-quality issues through clear technical communication and continuous improvement activities.

Key Requirements

  • •Bachelor's or master's degree in mechanical, electrical, electronics, mechatronics, materials, semiconductor engineering, computer science, data science, or related fields.
  • •Strong foundation in engineering mathematics, physics, problem solving, and data interpretation.
  • •Ability to learn semiconductor packaging concepts, design methods, manufacturing processes, and engineering systems.
  • •Programming or scripting exposure in Python, MATLAB, C/C++, or equivalent language.
  • •Clear communication and collaboration skills across functions to manage assigned work with discipline.
Experience:Semiconductor packagingSemiconductorAI/ML
Education:Master's
Skills:OwnershipLearning agilityDisciplined executionClear communicationCollaboration
Tech Stack:PythonMATLABC/C++CADEDAAI/MLAutomationData pipelinesGenerative AIPLMALMTeamcenterCAD/EDA

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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