New College Grad - HBM Design Architect | MS or PhD

Micron Technology
United States
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringEducation: mastersSkills: ["Analytical thinking","Problem-solving","Written communication","Verbal communication","Multidisciplinary collaboration"]

Develop and evaluate next-generation HBM and DRAM memory architectures in Micron’s Heterogeneous Integration Group. You’ll analyze system and block-level tradeoffs (performance, power, area, thermal behavior, reliability, and manufacturability) using analytical models, simulations, silicon data, and AI-assisted techniques. Work with architecture, circuit, layout, packaging, product, and system teams, conduct root-cause analysis, and communicate findings through reviews and written documentation.

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Micron Technology
Micron Technology
3 days ago

New College Grad - HBM Design Architect | MS or PhD

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Last checked: 14 hours agoStatus: Live

Job Summary

Develop and evaluate next-generation HBM and DRAM memory architectures in Micron’s Heterogeneous Integration Group. You’ll analyze system and block-level tradeoffs (performance, power, area, thermal behavior, reliability, and manufacturability) using analytical models, simulations, silicon data, and AI-assisted techniques. Work with architecture, circuit, layout, packaging, product, and system teams, conduct root-cause analysis, and communicate findings through reviews and written documentation.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Graduate level

Key Responsibilities

  • •Analyze HBM and DRAM architectures using analytical models, simulations, silicon data, and AI-assisted techniques to evaluate timing, bandwidth, power, area, thermal performance, reliability, and design complexity.
  • •Develop and apply modeling, simulation, and data-analysis methodologies to compare architectural approaches and identify design sensitivities for technology pathfinding.
  • •Collaborate with architecture, circuit design, layout, packaging, product, and system teams to evaluate feasibility, performance tradeoffs, signal integrity, power delivery, and manufacturability considerations.
  • •Perform root-cause analysis using simulation and measured data to improve model accuracy, validate assumptions, and provide evidence-based design recommendations.
  • •Communicate technical findings through presentations, design reviews, architecture discussions, and written documentation, clearly articulating assumptions, risks, and recommended actions.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Time-off

Key Requirements

  • •Master’s or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related field completed prior to the employment start date.
  • •Strong foundation in at least two areas such as CMOS circuits, digital or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, signal integrity, power delivery, or advanced packaging.
  • •Experience developing engineering models, simulations, or analytical methodologies through graduate research, coursework, internships, or laboratory projects.
  • •Demonstrated ability to evaluate complex technical problems and draw evidence-based conclusions.
  • •Strong analytical, problem-solving, and communication skills for presenting recommendations to multidisciplinary teams.
Education:Master's in Electrical Engineering, Computer Engineering, or a related field
Skills:Analytical thinkingProblem-solvingWritten communicationVerbal communicationMultidisciplinary collaboration
Tech Stack:AILarge Language Models (LLMs)Generative AIHSPICEFineSimSpectreSignal integrityPower deliveryAdvanced packaging

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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