Intel

1 week ago

CUF TD Module Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 day agoStatus: Live

Job Summary

Develop and optimize CUF (capillary underfill) module assembly processes and equipment to support Intel’s future assembly packaging roadmap. Own process and equipment specifications using design of experiments and data analysis, and evaluate silicon and package technologies under simulated field conditions. Drive manufacturability improvements, reliability requirements, and early quality/reliability issue identification through new techniques and quality screens, while standardizing qualification and partnering with engineering groups.

Location: Malaysia

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Develop assembly processes and/or equipment for CUF (capillary underfill) modules to enable future assembly packaging platform technologies.
•Optimize manufacturing efficiency for packages to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
•Develop process and equipment specifications using design of experiments and data analysis; document improvements via white papers.
•Develop and maintain equipment to evaluate silicon and package technologies under simulated field use conditions (heat, humidity, temperature cycling, dynamic forces).
•Establish material specifications for contract assemblers and vendors; coordinate with supplier quality and procurement to meet material quality and vendor performance requirements through process adherence and qualification methods.

Key Requirements

•MSc/PhD in Mechanical Engineering, Material Engineering, Electrical Engineering, Chemical Engineering, or Physics (thermal/fluid/packaging assembly process engineering focus) with at least 3 years of experience; a Bachelor’s with strong relevant experience may be considered.
•Fundamental understanding of semiconductor assembly equipment and processes.
•Developing new processes through hardware/toolset development is a plus.
•Ability to apply principles for design of experiments and data analysis.
•Experience defining reliability requirements and influencing design, material selection, and process development based on failure mechanisms.

Experience:3+ yearsSemiconductor manufacturing

Education:Master's in Mechanical Engineering/Material Engineering/Electrical Engineering/Chemical Engineering/Physics (thermal/fluid/packaging assembly process engineering focus)

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

1 week ago

CUF TD Module Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 day agoStatus: Live

Job Summary

Location: Malaysia

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Develop assembly processes and/or equipment for CUF (capillary underfill) modules to enable future assembly packaging platform technologies.
•Optimize manufacturing efficiency for packages to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
•Develop process and equipment specifications using design of experiments and data analysis; document improvements via white papers.
•Develop and maintain equipment to evaluate silicon and package technologies under simulated field use conditions (heat, humidity, temperature cycling, dynamic forces).
•Establish material specifications for contract assemblers and vendors; coordinate with supplier quality and procurement to meet material quality and vendor performance requirements through process adherence and qualification methods.

Key Requirements

•MSc/PhD in Mechanical Engineering, Material Engineering, Electrical Engineering, Chemical Engineering, or Physics (thermal/fluid/packaging assembly process engineering focus) with at least 3 years of experience; a Bachelor’s with strong relevant experience may be considered.
•Fundamental understanding of semiconductor assembly equipment and processes.
•Developing new processes through hardware/toolset development is a plus.
•Ability to apply principles for design of experiments and data analysis.
•Experience defining reliability requirements and influencing design, material selection, and process development based on failure mechanisms.

Experience:3+ yearsSemiconductor manufacturing

Education:Master's in Mechanical Engineering/Material Engineering/Electrical Engineering/Chemical Engineering/Physics (thermal/fluid/packaging assembly process engineering focus)

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor