Advanced Packaging Module Development Engineer

Intel
United States
Workplace: OnsiteFull timeUSD 133,800 - 255,200 annuallyFunction: Product ManagementExperience: 3+ yearsEducation: mastersSkills: ["Problem-solving","Adaptability","Collaboration","Communication","Detail-oriented"]

Own process integration and enablement for high-volume manufacturing and next-generation semiconductor technology. Design and develop sophisticated manufacturing processes, run feasibility studies, and perform pathfinding to support future device architectures. Optimize equipment and production output, collaborate with equipment and materials suppliers, and apply SPC/DOE to drive data-informed improvements. Leverage robotics, automation, vision, and image processing to advance manufacturing capabilities in Hillsboro’s on-site environment.

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Intel
Intel
3 days ago

Advanced Packaging Module Development Engineer

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Last checked: 8 hours agoStatus: Live

Job Summary

Own process integration and enablement for high-volume manufacturing and next-generation semiconductor technology. Design and develop sophisticated manufacturing processes, run feasibility studies, and perform pathfinding to support future device architectures. Optimize equipment and production output, collaborate with equipment and materials suppliers, and apply SPC/DOE to drive data-informed improvements. Leverage robotics, automation, vision, and image processing to advance manufacturing capabilities in Hillsboro’s on-site environment.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Drive technology development for high-volume manufacturing and future semiconductor technology nodes with process integration and equipment solutions.
  • •Lead design and development of manufacturing processes, including material selection, parameter optimization, metrology, and system design.
  • •Perform pathfinding activities and develop technology roadmaps for future product generations and device architectures.
  • •Recommend and implement equipment and process modifications to improve efficiency, refine techniques, and optimize production output.
  • •Collaborate with equipment and materials suppliers and conduct feasibility studies using simulations and engineering methods to validate new approaches.

Pay and Benefits

Salary: USD 133,800 - 255,200 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Master’s degree in a relevant engineering/science field (Materials Science and Engineering, Mechanical, Chemical, Electrical, Physics, Chemistry, or related) with 4+ years of relevant industry experience; or a PhD with 3+ years relevant experience.
  • •Technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
  • •Hands-on experience with robotics, automation systems, vision systems, or image processing.
  • •Experience applying Statistical Process Control (SPC) and Design of Experiments (DOE).
  • •Programming experience in Python or MATLAB, plus the ability to troubleshoot complex manufacturing processes and equipment.
Experience:3+ yearsSemiconductor processingManufacturingAutomationRoboticsStatistical process control
Education:Master's in Materials Science and Engineering; Mechanical Engineering; Chemical Engineering; Electrical Engineering; Physics; Chemistry (or related field)
Skills:Problem-solvingAdaptabilityCollaborationCommunicationDetail-oriented
Tech Stack:SPCDesign of Experiments (DOE)PythonMATLABRoboticsAutomation systemsVision systemsImage processingSystem controlsOpto-mechanics

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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