Intel

2 weeks ago

Thermal Quality and Reliability Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 3 hours agoStatus: Live

Job Summary

Drive quality and reliability standards for Intel’s semiconductor packaging components, ensuring they meet product and production requirements. Define inspection/testing approaches, metrology strategies, and reliability models using statistical analysis and failure-mode insights. Develop and sustain evaluation equipment under heat/humidity/temperature variations, improve processes through data-driven risk identification, and respond to quality excursions to troubleshoot and enhance packaging qualification.

Location: Phoenix

Workplace: Onsite

Employment Type: Full time

Job Function: Quality & Regulatory (Non-Software)

Seniority: Entry level

Key Responsibilities

•Develop and maintain quality and reliability standards for packaging components, including inspection/testing mechanisms and statistical quality assessments.
•Evaluate production materials, processes, and techniques against product and system-level requirements.
•Define metrology strategies to capture quality parameters across packaging modules.
•Analyze quality and wearout reliability data to identify risk areas and provide process-improvement insights.
•Develop and validate reliability models and acceleration/quality screens, including investigating quality excursions and troubleshooting to improve reliability and specifications.

Pay and Benefits

Salary: USD 120,860 - 170,630 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•PhD in Mechanical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Aerospace Engineering, or related field with at least 6 months experience in semiconductor packaging/assembly and failure modes.
•Proficiency in statistical process control, reliability modeling, and statistical data analysis.
•Knowledge of design of experiments (DOE) principles and data analytics tools.
•Experience with packaging technologies such as Ball Grid Array (BGA) or wafer-level manufacturing.
•Familiarity with analytical lab techniques like acoustic imaging, SEM, EDX, FTIR, or mechanical testing, plus programming/scripting for data analysis (Python, SQL).

Experience:Semiconductor packagingManufacturingReliability engineeringSemiconductor assembly

Education:PhD / Doctorate in Mechanical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Aerospace Engineering (or related field)

Skills:Cross-functional collaborationProblem-solvingInfluencingStatistical analysisLeadership

Tech Stack:PythonSQLDesign of experiments (DOE)Statistical process controlAcoustic imagingSEMEDXFTIRMechanical testing8D5 WhysBall Grid Array (BGA)Metrology

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

2 weeks ago

Thermal Quality and Reliability Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 3 hours agoStatus: Live

Job Summary

Location: Phoenix

Workplace: Onsite

Employment Type: Full time

Job Function: Quality & Regulatory (Non-Software)

Seniority: Entry level

Key Responsibilities

•Develop and maintain quality and reliability standards for packaging components, including inspection/testing mechanisms and statistical quality assessments.
•Evaluate production materials, processes, and techniques against product and system-level requirements.
•Define metrology strategies to capture quality parameters across packaging modules.
•Analyze quality and wearout reliability data to identify risk areas and provide process-improvement insights.
•Develop and validate reliability models and acceleration/quality screens, including investigating quality excursions and troubleshooting to improve reliability and specifications.

Pay and Benefits

Salary: USD 120,860 - 170,630 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•PhD in Mechanical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Aerospace Engineering, or related field with at least 6 months experience in semiconductor packaging/assembly and failure modes.
•Proficiency in statistical process control, reliability modeling, and statistical data analysis.
•Knowledge of design of experiments (DOE) principles and data analytics tools.
•Experience with packaging technologies such as Ball Grid Array (BGA) or wafer-level manufacturing.
•Familiarity with analytical lab techniques like acoustic imaging, SEM, EDX, FTIR, or mechanical testing, plus programming/scripting for data analysis (Python, SQL).

Experience:Semiconductor packagingManufacturingReliability engineeringSemiconductor assembly

Education:PhD / Doctorate in Mechanical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Aerospace Engineering (or related field)

Skills:Cross-functional collaborationProblem-solvingInfluencingStatistical analysisLeadership

Tech Stack:PythonSQLDesign of experiments (DOE)Statistical process controlAcoustic imagingSEMEDXFTIRMechanical testing8D5 WhysBall Grid Array (BGA)Metrology

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor