Product Integration Engineer

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 5+ yearsEducation: mastersSkills: ["Cross-functional collaboration","Technical leadership","Risk assessment","Continuous improvement","Problem-solving"]

Own process and technology integration for advanced semiconductor package architectures, leading NPI phase-gate deliverables through qualification readiness, reliability validation, and defect reduction. Drive yield ramp, process stability, and manufacturing readiness by partnering with Operations, Quality, and Site teams, performing root-cause analysis for excursions. Provide PI program leadership across TD, PIE, NPI, QA, CEM, and Operations to align milestones, risks, and mitigations, while continuously improving process maturity, yield, and cost.

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FursaFursa
Micron Technology
Micron Technology
2 weeks ago

Product Integration Engineer

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Last checked: 15 hours agoStatus: Live

Job Summary

Own process and technology integration for advanced semiconductor package architectures, leading NPI phase-gate deliverables through qualification readiness, reliability validation, and defect reduction. Drive yield ramp, process stability, and manufacturing readiness by partnering with Operations, Quality, and Site teams, performing root-cause analysis for excursions. Provide PI program leadership across TD, PIE, NPI, QA, CEM, and Operations to align milestones, risks, and mitigations, while continuously improving process maturity, yield, and cost.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Lead process integration for new package architectures, including materials, structure, process flow definition, and technical risk assessment.
  • •Own process integration deliverables across NPI phase gates, driving qualification builds and ensuring readiness for Qualification Release (QR).
  • •Drive yield ramp, defect reduction, and process stability toward high-volume manufacturing by partnering with Manufacturing, Quality, and Site teams.
  • •Interface across TD, PIE, NPI, QA, CEM, and Operations teams as the PI owner, aligning milestones, risks, and mitigations.
  • •Improve process maturity through continuous improvement activities for yield, cycle time, and cost, and feed learnings into design rules and standards.

Key Requirements

  • •Bachelor’s or Master’s degree in Engineering (Materials, Chemical, Electrical, Mechanical, or related field).
  • •5–10+ years of experience in semiconductor advanced packaging / process integration.
  • •Strong knowledge of advanced packaging (HBM, 3DS, flip chip, TSV, etc.), process integration, yield analysis, and defect mechanisms.
  • •Experience with qualification, reliability, and NPI phase gate execution.
  • •Experience in cross-functional program execution and multi-site collaboration.
Experience:5+ yearsSemiconductor advanced packagingProcess integrationNPIQualificationReliabilityYieldManufacturing
Education:Master's in Engineering (Materials, Chemical, Electrical, Mechanical, or related field)
Skills:Cross-functional collaborationTechnical leadershipRisk assessmentContinuous improvementProblem-solving
Tech Stack:Advanced packagingHBM3DSFlip chipTSVProcess integrationYield analysisDefect mechanismsQualificationReliabilityNPI phase gatesFMEADFMEAPFMEATRADOECTQ parametersProcess windowDesign-for-manufacturability (DFM)Design rules

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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