Intern - Wafer Bonding Process Development

Micron Technology
Boise
Workplace: OnsiteInternshipFunction: Communications, PR & CommunitySkills: ["Communication","Problem-solving","Independent work","Collaboration","Attention to detail"]

Work with the Wafer Bonding team in Micron’s Technology Development organization to research, develop, and optimize advanced wafer bonding technologies for next-generation semiconductor products. Plan and execute experiments, evaluate new process solutions and equipment, and analyze data to improve yield, quality, cycle time, and manufacturability. Use approved AI and AI-enabled tools plus advanced analytics to accelerate learning and process development in a modern R&D environment.

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Micron Technology
Micron Technology
4 weeks ago

Intern - Wafer Bonding Process Development

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Last checked: 18 hours agoStatus: Live

Job Summary

Work with the Wafer Bonding team in Micron’s Technology Development organization to research, develop, and optimize advanced wafer bonding technologies for next-generation semiconductor products. Plan and execute experiments, evaluate new process solutions and equipment, and analyze data to improve yield, quality, cycle time, and manufacturability. Use approved AI and AI-enabled tools plus advanced analytics to accelerate learning and process development in a modern R&D environment.
Location: Boise
Workplace: Onsite
Employment Type: Internship
Job Function: Communications, PR & Community
Seniority: Intern level

Key Responsibilities

  • •Support R&D of manufacturable wafer bonding technologies for next-generation semiconductor devices.
  • •Plan, execute, and analyze experiments, and communicate findings via technical reports and presentations.
  • •Identify and implement process improvements to enhance yield, quality, cycle time, and manufacturing readiness.
  • •Evaluate new wafer bonding equipment, materials, and process solutions through characterization and data analysis.
  • •Leverage approved AI and AI-enabled tools to improve productivity and accelerate process development activities.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •Currently pursuing an MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, or a related technical field.
  • •Demonstrated understanding of wafer bonding principles and semiconductor processing applications.
  • •Research, laboratory, internship, or project experience in a semiconductor-related field.
  • •Working knowledge of statistics, mathematical analysis, and experimental design methodologies.
  • •Strong written, verbal, and presentation skills to communicate technical concepts effectively.
Experience:SemiconductorR&DInternshipLaboratory
Education:
Skills:CommunicationProblem-solvingIndependent workCollaborationAttention to detail
Tech Stack:Artificial Intelligence (AI)AI-enabled toolsMachine learningStatisticsExperimental designData analysisData visualization

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn