EMIB-T Substrate Program Integrator

Intel
Phoenix
Workplace: OnsiteFull timeUSD 89,010 - 170,630 annuallyFunction: Communications, PR & CommunityEducation: bachelorsSkills: ["Leadership","Project management","Problem-solving","Ability to thrive in high-ambiguity","Cross-functional collaboration"]

Lead EMIB-T substrate technology development and qualification activities within the Advanced Packaging Technology Development organization. Drive technical enablement and manage readiness milestones to ensure suppliers can support growing customer demand. Partner with cross-functional engineering teams, suppliers, and assembly platform partners to align execution, deliver results in high-ambiguity environments, and apply advanced packaging, characterization, and process-development methods.

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Intel
Intel
1 day ago

EMIB-T Substrate Program Integrator

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Lead EMIB-T substrate technology development and qualification activities within the Advanced Packaging Technology Development organization. Drive technical enablement and manage readiness milestones to ensure suppliers can support growing customer demand. Partner with cross-functional engineering teams, suppliers, and assembly platform partners to align execution, deliver results in high-ambiguity environments, and apply advanced packaging, characterization, and process-development methods.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Lead EMIB-T substrate technology development and qualification activities to ensure supplier readiness.
  • •Drive technical enablement and manage readiness milestones aligned to customer demand.
  • •Collaborate closely with cross-functional engineering teams, suppliers, and assembly platform partners to align execution.
  • •Support supplier readiness through technical coordination in TD/high-volume manufacturing environments.
  • •Apply characterization and process-development approaches to enable technology qualification and yield improvement.

Pay and Benefits

Salary: USD 89,010 - 170,630 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor's degree with 6+ years of experience, or Master's degree with 4+ years, or PhD with 2+ years in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
  • •Experience managing complex projects and delivering results in TD/high-volume manufacturing environments.
  • •Strong foundation in advanced packaging, substrates, or semiconductor manufacturing, with proven leadership in supplier management or technology enablement.
  • •Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies, thriving in high-ambiguity environments.
  • •Familiarity with characterization and statistical/process methods, including X-ray, SEM, FTIR, EDX, FMEA, DOE, problem-solving tools, and SPC yield improvement.
Experience:Advanced packagingSemiconductor manufacturingHigh-volume manufacturing
Education:Bachelor's
Skills:LeadershipProject managementProblem-solvingAbility to thrive in high-ambiguityCross-functional collaboration
Tech Stack:FMEADOESPCX-raySEMFTIREDXStatistical tools

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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