Engineer, Product & System Engineering (Media Health Manufacturing), Heterogenous Integration - High Bandwidth Memory

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Manufacturing & Production OperationsEducation: bachelorsSkills: ["Problem-solving","Technical decision-making","Innovation","Cross-functional collaboration","Project management"]

Drive Media Health Manufacturing for Micron’s next-generation High Bandwidth Memory (HBM) products, spanning DRAM and interface die stacked products. Own optimized manufacturing test coverage, develop and validate test flows, improve yield and cost by resolving device issues, and reduce test time. Support new product design verification using CAD tools and Verilog simulations, promote technical innovation, and collaborate with cross-functional teams across Fab, HBM technology/design, system development, and quality/reliability.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
7 months ago

Engineer, Product & System Engineering (Media Health Manufacturing), Heterogenous Integration - High Bandwidth Memory

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 7 hours agoStatus: Live

Job Summary

Drive Media Health Manufacturing for Micron’s next-generation High Bandwidth Memory (HBM) products, spanning DRAM and interface die stacked products. Own optimized manufacturing test coverage, develop and validate test flows, improve yield and cost by resolving device issues, and reduce test time. Support new product design verification using CAD tools and Verilog simulations, promote technical innovation, and collaborate with cross-functional teams across Fab, HBM technology/design, system development, and quality/reliability.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Manufacturing & Production Operations

Key Responsibilities

  • •Ensure optimized test coverage for current and future HIG HBM design architectures and process nodes for high-volume manufacturing.
  • •Develop, validate, characterize, and qualify next-generation HBM products to support market readiness.
  • •Provide support for design verification and in-depth circuit analysis using CAD tools and Verilog simulations.
  • •Improve manufacturing test yields and reduce test time by resolving device issues and yield-related problems for DRAM, interface, and stacked die.
  • •Drive innovation through technical changes, including risk analysis and project prioritization, and coordinate cross-functional work to ship end products.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical and Electronics Engineering (or related field).
  • •Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • •Experience with problem-solving methodologies to identify root causes and explore solution spaces.
  • •Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
  • •Experience supporting semiconductor devices, circuit design, or product validation (coursework or internship is a plus).
Experience:SemiconductorDRAMManufacturingHigh-bandwidth memory (HBM)
Education:Bachelor's in Electrical and Electronics Engineering
Skills:Problem-solvingTechnical decision-makingInnovationCross-functional collaborationProject management
Tech Stack:PythonJMPVerilogCADCMOSDRAM architecture

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn