MTS - Adv Pkg TD Integrator

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 10+ yearsEducation: phdSkills: ["Project management","Communication","Presentation","Collaboration","Risk mitigation"]

Develop and qualify advanced packaging process solutions for Micron’s advanced packaging (APTD) products. Lead technode process readiness to improve yield, quality, and reliability through process characterization, optimization, and new materials/equipment introductions. Own execution of process readiness activities (e.g., TRA, risk mitigation, recipe readiness) and drive smooth transitions from development to 1st qualification and small-volume production launch, collaborating cross-functionally to resolve process issues.

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Micron Technology
Micron Technology
4 months ago

MTS - Adv Pkg TD Integrator

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Last checked: 6 hours agoStatus: Live

Job Summary

Develop and qualify advanced packaging process solutions for Micron’s advanced packaging (APTD) products. Lead technode process readiness to improve yield, quality, and reliability through process characterization, optimization, and new materials/equipment introductions. Own execution of process readiness activities (e.g., TRA, risk mitigation, recipe readiness) and drive smooth transitions from development to 1st qualification and small-volume production launch, collaborating cross-functionally to resolve process issues.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Develop advanced packaging process solutions and ensure success of new process, equipment, material, and path-finding activities for all advanced packaging products.
  • •Lead technode process readiness and improve yield, quality, and reliability via process characterization and optimization.
  • •Drive cross-functional collaboration to resolve process-related problems and enable best technology selection for new technodes.
  • •Manage development, qualification, and execution of process readiness activities (including CPI NUDD, process TRA, and risk mitigation) prior to silicon arrival to ensure first-pass rate.
  • •Develop and establish process capabilities, strategy, and roadmap; support technology trend planning for future packaging solutions and capabilities.

Key Requirements

  • •PhD/Masters/Bachelor’s degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics, or equivalent.
  • •10+ years’ experience in the semiconductor industry, preferably in R&D, technology development, or failure analysis.
  • •Strong expertise in failure analysis methodologies and techniques, with experience in DRAM/NAND technology.
  • •Experience in frontend fab process integration or module process, and backend advanced packaging wafer/die-level process or integration.
  • •Experience with temporary/permanent bonding technologies (wafer-on-wafer, chip-on-wafer) and understanding silicon integration interactions across CPI and backend/package processes.
Experience:10+ yearsSemiconductor industryR&DFailure analysisDRAMNAND
Education:PhD / Doctorate in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics
Skills:Project managementCommunicationPresentationCollaborationRisk mitigation
Tech Stack:DRAMNANDSimulation toolsData analytics platformsProcess characterizationCPITemporary bondingPermanent bondingWafer on waferChip on wafer

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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