MTS – ASIC Device Technology & Silicon Yield Engineering

Micron Technology
Hyderabad, Telangana, India
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 12+ yearsSkills: ["Root-cause analysis","Technical leadership","Cross-functional collaboration","Debug strategy","Executive communication"]

Lead post-silicon yield and RMA investigations for complex ASIC failures, driving root-cause analysis across process, design, test, package, and system interactions. Own containment, corrective actions, and prevention plans while analyzing device-level failure mechanisms affecting analog, mixed-signal, memory, high-speed I/O, and PCIe PHY performance. Execute advanced physical/failure analysis (e.g., FIB/SEM/TEM/EFA/OBIRCH) and translate findings into actionable design/process improvements.

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Micron Technology
Micron Technology
1 week ago

MTS – ASIC Device Technology & Silicon Yield Engineering

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Job Summary

Lead post-silicon yield and RMA investigations for complex ASIC failures, driving root-cause analysis across process, design, test, package, and system interactions. Own containment, corrective actions, and prevention plans while analyzing device-level failure mechanisms affecting analog, mixed-signal, memory, high-speed I/O, and PCIe PHY performance. Execute advanced physical/failure analysis (e.g., FIB/SEM/TEM/EFA/OBIRCH) and translate findings into actionable design/process improvements.
Location: Hyderabad, Telangana, India
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Lead end-to-end investigation of silicon yield loss, field returns, customer escalations, and reliability failures to drive root-cause analysis.
  • •Develop hypothesis-driven debug strategies and coordinate multi-functional execution across process, design, test, package, and system interactions.
  • •Own resolution of critical yield and quality issues through containment, corrective actions, and prevention plans.
  • •Perform advanced failure analysis and physical debug (e.g., FIB/SEM/TEM/EFA/OBIRCH/LVP) and translate results into engineering actions.
  • •Lead technical reviews and present findings to executive leadership while feeding silicon learnings into next-generation ASIC architecture and methodologies.

Key Requirements

  • •Ph.D. or M.S. (or equivalent experience) in Electrical Engineering, Materials Science, Physics, or Semiconductor Engineering.
  • •12+ years of semiconductor industry experience with advanced CMOS technology and silicon product development.
  • •Proven success leading yield improvement, RMA, and failure analysis efforts, including work with foundries and OSAT partners.
  • •Strong expertise in SRAM architecture and memory margin analysis, plus failure mechanisms across transistor/circuit/block/die/package/system levels.
  • •Deep knowledge of high-speed interfaces (PCIe, ONFI, LPDDR, SerDes) and variation-aware, process-design interaction analysis with SI/PI/timing closure.
Experience:12+ yearsSemiconductorCMOSASICPost-siliconYield engineeringFailure analysisRMA
Education:
Skills:Root-cause analysisTechnical leadershipCross-functional collaborationDebug strategyExecutive communication
Tech Stack:ASICCMOSSRAMPCIeONFILPDDRSerDesFIBSEMTEMEFAOBIRCHLVPEmission microscopySignal IntegrityPower IntegrityTiming closure

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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