EMIB-T Substrate Yield Lead

Intel
Phoenix
Workplace: OnsiteFull timeUSD 180,770 - 255,200 annuallyFunction: Administration & Executive AssistanceExperience: 5+ yearsEducation: mastersSkills: ["Analytical thinking","Problem-solving","Data-driven decision making","Cross-functional influence","Independent execution"]

Lead end-to-end EMIB-T substrate yield performance for next-generation advanced packaging technologies. Own defect pareto closure, DFM/DFY and process optimization from signal identification through execution, and drive daily yield huddles and cross-functional reviews across IFS and IPG. Build yield intelligence infrastructure (dashboards, automated analytics, image analytics, computer vision, and AI/ML defect detection) to enable technology deployment, scaling, and on-schedule program readiness.

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FursaFursa
Intel
Intel
5 days ago

EMIB-T Substrate Yield Lead

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Job Summary

Lead end-to-end EMIB-T substrate yield performance for next-generation advanced packaging technologies. Own defect pareto closure, DFM/DFY and process optimization from signal identification through execution, and drive daily yield huddles and cross-functional reviews across IFS and IPG. Build yield intelligence infrastructure (dashboards, automated analytics, image analytics, computer vision, and AI/ML defect detection) to enable technology deployment, scaling, and on-schedule program readiness.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Mid level

Key Responsibilities

  • •Own end-to-end substrate yield performance for EMIB-T technology development and manufacturing readiness.
  • •Drive DFM/DFY engagement, defect pareto closure, process optimization, and yield improvement plans from signal identification through execution.
  • •Lead daily yield huddles and cross-functional reviews to ensure program execution stays on track and yield risks are addressed with urgency.
  • •Identify, prioritize, and drive closure of critical yield, reliability, process, and supplier-related issues with minimal oversight.
  • •Define and scale yield intelligence infrastructure (dashboards, automated analytics, image analytics, computer vision, AI/ML defect detection, and automated defect classification) and enable EMIB-T deployment across products and business groups.

Pay and Benefits

Salary: USD 180,770 - 255,200 annually
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Master's degree (6+ years) or PhD (4+ years) in Engineering, Materials Science, Physics, Chemistry, Data Science, or a related technical discipline.
  • •5+ years of experience in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related field.
  • •Hands-on experience in substrate/advanced packaging/semiconductor yield engineering, including statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and HVM execution.
  • •Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML defect detection, or automated defect classification systems.
  • •Demonstrated ability to independently manage complex technical issues and drive actions to closure across multiple organizations and stakeholders.
Experience:5+ yearsSemiconductor manufacturingAdvanced packagingYield engineeringProcess engineering
Education:Master's
Skills:Analytical thinkingProblem-solvingData-driven decision makingCross-functional influenceIndependent execution
Tech Stack:EMIB-TEmbedded Multi-die Interconnect Bridge with TSVTSV2.5D/3D integrationSubstratesHeterogeneous integrationSPCDFM/DFYDefect metrologyFailure analysisHVM executionYield monitoringDashboardsAutomated analyticsImage analyticsComputer visionAI/MLDefect classification

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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