AMD

1 week ago

Packaging Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 14 hours agoStatus: Live

Job Summary

Develop and deploy AI-driven automation workflows to improve the efficiency, quality, and scalability of complex package, bridge, and interposer design. Translate advanced packaging design challenges into scalable automation solutions, applying AI/ML to activities such as auto-routing, placement optimization, and design-rule verification. Partner with package design, EDA tool, and vendor teams to enhance automation capabilities, integrate design flows, analyze data, and support tape-outs while building reusable best practices.

Location: Taiwan

Workplace: Hybrid

Employment Type: Full time

Job Function: Software Engineering

Seniority: Mid level

Key Responsibilities

•Develop, deploy, and maintain automation frameworks and AI-assisted workflows for package substrates, silicon interposers, and bridge-based integration.
•Apply AI/ML methodologies to improve design activities including auto-routing, placement optimization, signal integrity, power delivery, and design rule compliance/verification.
•Collaborate with the package design team to identify automation opportunities that reduce manual effort and cycle time while improving robustness and quality.
•Partner with EDA tools teams and vendors to implement automation features and enhance tool capabilities and workflows.
•Develop automation and tools for design-flow integration, data extraction/analysis, closed-loop optimization, and support design milestones and tape-outs.

Pay and Benefits

Salary: TWD 1,691,060 - 2,415,800 annually

Key Requirements

•5+ years of experience in semiconductor packaging or SOC physical design automation.
•Strong working knowledge of EDA packaging tools such as Cadence APD/SiP, Siemens Xpedition, and Synopsys 3DICC (or equivalent).
•Expertise in scripting and automation using Python (preferred), Tcl, SKILL, or C++.
•Experience applying AI/ML techniques to engineering or design workflows, including familiarity with PyTorch or TensorFlow.
•Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.

Experience:5+ yearsSemiconductor packagingSOC physical design automationEDAAI/MLAdvanced packaging

Education:Bachelor's in Electrical Engineering, Computer Engineering, Computer Science or related field

Skills:Problem-solvingOwnership mindsetCommunicationCollaboration

Languages:English

Tech Stack:PythonTclSKILLC++PyTorchTensorFlowCadence APD/SiPSiemens XpeditionSynopsys 3DICCEDA toolsDRCLVSParasitic extractionSignal integrityPower delivery2.5D3D ICChipletsHeterogeneous integration

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

Loading job details...

Preparing the role view and application actions.

AMD