Principal/MTS Vapor/Thermal Etch Development Engineer, Advanced DRAM Wet Etch

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: phdSkills: ["Root-cause analysis","Model-based problem-solving","Cross-functional collaboration","Independent work","Communication"]

Lead development and integration of advanced thermal, vapor, and atomic layer etch processes for next-generation DRAM. Own the process roadmap to meet program and yield goals, performing feasibility studies, technical investigations, and root-cause analysis for complex process challenges. Partner with Process Integration, equipment development engineers, hardware vendors, and cross-functional teams to improve readiness, yield, and future strategy through emerging technology evaluation and intellectual property support.

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Micron Technology
Micron Technology
2 weeks ago

Principal/MTS Vapor/Thermal Etch Development Engineer, Advanced DRAM Wet Etch

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Source: Company careers pageValidated by: Fursa AI
Last checked: 3 hours agoStatus: Live
Reposted: similar role first listed 1 week ago

Job Summary

Lead development and integration of advanced thermal, vapor, and atomic layer etch processes for next-generation DRAM. Own the process roadmap to meet program and yield goals, performing feasibility studies, technical investigations, and root-cause analysis for complex process challenges. Partner with Process Integration, equipment development engineers, hardware vendors, and cross-functional teams to improve readiness, yield, and future strategy through emerging technology evaluation and intellectual property support.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Sr. Manager level

Key Responsibilities

  • •Develop and integrate advanced thermal, vapor, and atomic layer etch processes for next-generation DRAM technologies.
  • •Lead feasibility studies, technical investigations, and root-cause analysis to resolve complex process challenges.
  • •Own process roadmaps, technical readiness, and yield improvements to meet program objectives.
  • •Collaborate with Process Integration, equipment development, hardware vendors, and cross-functional engineering teams to deliver process solutions.
  • •Contribute to intellectual property development and evaluate emerging technologies to influence future strategy.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid HolidaysIncome Protection

Key Requirements

  • •PhD with 5+ years of professional experience or a master's degree with 7+ years of professional experience.
  • •10+ years of experience in physics, chemistry, chemical engineering, materials science, or a related field.
  • •Expert knowledge of semiconductor manufacturing and experience developing thermal, vapor, or atomic layer etch processes.
  • •Demonstrated success solving complex technical challenges using root-cause analysis or model-based problem-solving methods.
  • •Expert knowledge of thermodynamics, gas-phase reactions, transport phenomena, and reaction characterization; experience leading cross-functional engineering initiatives.
Education:PhD / Doctorate
Skills:Root-cause analysisModel-based problem-solvingCross-functional collaborationIndependent workCommunication
Tech Stack:Vapor etchThermal etchAtomic layer etchSemiconductor manufacturingThermodynamicsGas-phase reactionsTransport phenomenaReaction characterizationCVDDiffusionLithographyCMPSPC

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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