Product Integration Lead, HIG High Bandwidth Memory

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceExperience: 10+ yearsSkills: ["Collaboration","Communication","Presentation","Problem-solving","Risk assessment"]

Lead product integration for Micron’s HBM offerings by aligning HBM products to end-system requirements in the HIG HBM Product Development Team. Drive swimlane development requirements (SCD), manage change initiatives and late/post qualification changes through the Change Control Board, and coordinate system–silicon alignment across architecture, product, systems engineering, technology development, packaging, and quality teams to resolve technical gaps, risks, and interaction failures.

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Micron Technology
Micron Technology
1 year ago

Product Integration Lead, HIG High Bandwidth Memory

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Job Summary

Lead product integration for Micron’s HBM offerings by aligning HBM products to end-system requirements in the HIG HBM Product Development Team. Drive swimlane development requirements (SCD), manage change initiatives and late/post qualification changes through the Change Control Board, and coordinate system–silicon alignment across architecture, product, systems engineering, technology development, packaging, and quality teams to resolve technical gaps, risks, and interaction failures.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance

Key Responsibilities

  • •Manage technical inputs and drive silicon–system alignment on requirements and commitments using the Success Criteria Document (SCD).
  • •Collaborate with HBM Architecture, Product and Systems Engineering, Business Unit, Technology Development, Packaging, and Global Quality to close gaps between HBM commitments and system requirements.
  • •Manage HBM sample usage and delivery in sync with system development needs and timelines.
  • •Drive resolution of technical challenges by identifying opportunities within development schedule, risks, and incremental development costs.
  • •Lead triage and change management: assess risks, coordinate mitigations, lead triage for system/chip feature interactions, and run Qualification Definition and changes through the Change Control Board for late/post qual changes.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical or Computer Engineering.
  • •10+ years of demonstrated ability in product, design, yield enhancement, or related engineering fields.
  • •Ability to lead technical issues to closure with creative, effective solutions in a highly collaborative environment.
  • •Desire to develop knowledge and expertise in overall HBM to system development.
  • •Excellent interpersonal, communication, and presentation skills to gather technical inputs and drive issue resolution/mitigation.
Experience:10+ years
Education:
Skills:CollaborationCommunicationPresentationProblem-solvingRisk assessment

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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