Packaging Module Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 133,800 - 188,890 annuallyFunction: Product ManagementExperience: 1+ yearsEducation: phdSkills: ["Data-driven problem solving","Problem-solving"]

Develop and optimize assembly processes and equipment for Intel’s advanced semiconductor packaging technologies. Improve manufacturing efficiency while meeting quality, reliability, cost, yield, productivity, and manufacturability targets. Create process/equipment specifications using design of experiments and statistical methods, evaluate package technologies under simulated field conditions, and standardize qualification and manufacturing quality methods across teams and partners.

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Intel
Intel
3 days ago

Packaging Module Development Engineer

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Last checked: 2 hours agoStatus: Live

Job Summary

Develop and optimize assembly processes and equipment for Intel’s advanced semiconductor packaging technologies. Improve manufacturing efficiency while meeting quality, reliability, cost, yield, productivity, and manufacturability targets. Create process/equipment specifications using design of experiments and statistical methods, evaluate package technologies under simulated field conditions, and standardize qualification and manufacturing quality methods across teams and partners.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Develop assembly processes and/or equipment and apply novel concepts to advance Intel’s assembly packaging platform technologies.
  • •Optimize and improve manufacturing efficiency by defining process and equipment specifications that meet quality, reliability, cost, yield, productivity, and manufacturability goals.
  • •Develop and maintain equipment and techniques to evaluate silicon and package technologies under simulated field use conditions and ensure manufacturability of package layouts.
  • •Establish material specifications for contract assemblers and raw material vendors and coordinate with supplier quality and procurement to ensure material quality and vendor performance.
  • •Lead equipment/process innovation and continuous improvement using experimental design and statistical methods, including standardization in qualification and manufacturing quality systems.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 1+ years of experience.
  • •1+ years applying statistical analysis techniques including Design of Experiments (DOE) and Statistical Process Control (SPC) for technical root cause analysis.
  • •1+ years of experience in process development, characterization, optimization, or qualification in semiconductor manufacturing, packaging, or materials engineering.
  • •Experience using data analysis tools such as Python, MATLAB, JMP, Minitab, or equivalent software.
  • •Knowledge of reliability engineering principles, failure mechanisms, and accelerated stress testing methods.
Experience:1+ yearsSemiconductor manufacturingSemiconductor packagingReliability engineeringMaterials engineering
Education:PhD / Doctorate
Skills:Data-driven problem solvingProblem-solving
Tech Stack:PythonMATLABJMPMinitabDesign of Experiments (DOE)Statistical Process Control (SPC)

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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