Engineer, HIG HBM Layout

Micron Technology
Hyderabad
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 3-7 yearsSkills: ["Leadership","Problem-solving","Communication","Detail-oriented","Methodical"]

Design and develop critical analog, mixed-signal, custom digital blocks and provide full chip integration support for Micron’s HBM team. Perform IC layout design and verification (LVS/DRC/Antenna), ensure quality checks and documentation, and deliver on-time block-level layouts. Coordinate across global engineering teams, plan and estimate area/time and milestones, and guide junior team members through sub-block layout execution and review.

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FursaFursa
Micron Technology
Micron Technology
3 weeks ago

Engineer, HIG HBM Layout

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Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live
Reposted: first listed 14 hours ago

Job Summary

Design and develop critical analog, mixed-signal, custom digital blocks and provide full chip integration support for Micron’s HBM team. Perform IC layout design and verification (LVS/DRC/Antenna), ensure quality checks and documentation, and deliver on-time block-level layouts. Coordinate across global engineering teams, plan and estimate area/time and milestones, and guide junior team members through sub-block layout execution and review.
Location: Hyderabad
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Design and develop critical analog, mixed-signal, custom digital blocks and support full chip level integration.
  • •Perform layout verification and quality checks including LVS, DRC, and Antenna, with documentation.
  • •Deliver on-time block-level layouts with acceptable quality across multiple project schedules.
  • •Plan, estimate area/time, schedule, delegate, and execute tasks to meet project milestones in a multi-project environment.
  • •Guide junior team members in sub-block layout execution and review work; communicate effectively with global engineering teams.

Key Requirements

  • •3 to 7 years of experience in memory/custom layout design for advanced CMOS process nodes (Planar, FinFET).
  • •Hands-on expertise with Cadence VLE/VXL and Mentor Graphics Calibre (DRC/LVS).
  • •Experience creating layouts of critical blocks such as Temperature sensor, PLL, ADC, DAC, LDO, Bandgap, reference generators, charge pump, current mirrors, comparator, and differential amplifier.
  • •Strong understanding of analog layout fundamentals (e.g., matching, electro-migration, latch-up, coupling/crosstalk, IR-drop, static device parasitics).
  • •Ability to implement high-quality layouts based on design constraints and support multiple tape-outs; BE or MTech in Electronic/VLSI Engineering is required.
Experience:3-7 yearsMemoryCustom layoutAdvanced CMOSPlanarFinFET
Education:
Skills:LeadershipProblem-solvingCommunicationDetail-orientedMethodical
Tech Stack:Cadence VLECadence VXLMentor Graphics CalibreDRCLVSAntenna

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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