Packaging Engineer

AMD
Suzhou
Workplace: OnsiteFull timeCNY 273,840 - 391,200 annuallyFunction: Industrial, Process & Manufacturing EngineeringExperience: 5+ yearsEducation: mastersSkills: ["Cross-functional project management","Conflict management","Analytics","Troubleshooting","Interpersonal skills","Presentation","Communication","Writing","Speaking (English)"]

Drive supplier engagement for external Wire Bond/Flip Chip Assembly/Bumping manufacturers to deliver key performance metrics such as yield and excursion-free operation. Lead NPI and ramp-up readiness, drive issue resolution and prevention, and monitor external manufacturing performance across yield and out-of-control lot disposition. Support change management, continuous improvement, and process simplification, with occasional on-site audit travel and regional supplier management.

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FursaFursa
AMD
AMD
2 days ago

Packaging Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live

Job Summary

Drive supplier engagement for external Wire Bond/Flip Chip Assembly/Bumping manufacturers to deliver key performance metrics such as yield and excursion-free operation. Lead NPI and ramp-up readiness, drive issue resolution and prevention, and monitor external manufacturing performance across yield and out-of-control lot disposition. Support change management, continuous improvement, and process simplification, with occasional on-site audit travel and regional supplier management.
Location: Suzhou
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Drive supplier engagement for continuous improvement and new capabilities ahead of need.
  • •Plan and lead New Product Introduction activities and ramp-up readiness.
  • •Drive external manufacturing issue resolution and issue prevention.
  • •Execute special work requests with comprehensive reporting and monitor yield, out-of-control lot disposition, and outlier reporting.
  • •Plan and execute change management and proactively drive continuous improvement for process simplification and quality enhancement, including occasional travel for audits.
Travel: Low travel

Pay and Benefits

Salary: CNY 273,840 - 391,200 annually

Key Requirements

  • •Strong knowledge of Flip Chip/Wire Bond assembly processes, with added advantage in bumping/RDL process experience.
  • •Minimum 5 years of process development work leading to volume production in a semiconductor ASIC facility.
  • •Familiarity with tools including AI agents, JMP, Minitab, and failure analysis and package reliability knowledge.
  • •Knowledge of industry standards including ESD, JEDEC, and Automotive.
  • •Bachelor’s/Master’s degree in Mechanical, Material, or Chemical Engineering.
Experience:5+ yearsSemiconductorASICProcess developmentManufacturing
Education:Master's in Mechanical or Material or Chemical Engineering
Skills:Cross-functional project managementConflict managementAnalyticsTroubleshootingInterpersonal skillsPresentationCommunicationWritingSpeaking (English)
Languages:English
Tech Stack:AI agentsJMPMinitab

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
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Glassdoor: 3.9
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