Senior Packaging Technical Engineer - Hardware

NVIDIA
United States, California
Workplace: RemoteFull timeUSD 168,000 - 258,750 annuallyFunction: Solutions Engineering & Sales EngineeringExperience: 8+ yearsEducation: bachelorsSkills: ["Problem-solving","Communication","Proactive ownership","Working independently"]

Define and implement silicon pad rings, substrate interconnect schemes, and lead package layout design for advanced hardware. Work across circuit, signal integrity, RTL, place & route, substrate layout, and system design teams to develop chip floor plans, pad rings, substrate, and ball-outs while solving complex electrical packaging challenges. Use strong transmission line, power delivery, and signal integrity knowledge, and contribute clear communication across functions.

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FursaFursa
NVIDIA
NVIDIA
2 days ago

Senior Packaging Technical Engineer - Hardware

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Last checked: 23 hours agoStatus: Live

Job Summary

Define and implement silicon pad rings, substrate interconnect schemes, and lead package layout design for advanced hardware. Work across circuit, signal integrity, RTL, place & route, substrate layout, and system design teams to develop chip floor plans, pad rings, substrate, and ball-outs while solving complex electrical packaging challenges. Use strong transmission line, power delivery, and signal integrity knowledge, and contribute clear communication across functions.
Location: United States, California
Workplace: Remote
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Define and implement the chip pad ring, substrate interconnect scheme, and package layout design process.
  • •Collaborate with circuit, signal integrity, RTL, place and route, substrate layout, and system design teams.
  • •Define chip floor plan, pad ring, substrate, and ball out to implement robust electrical packaging.
  • •Work with multiple package technology types and complex technologies.
  • •Communicate effectively across teams throughout the company.

Pay and Benefits

Salary: USD 168,000 - 258,750 annually
Equity and Bonus:Equity

Key Requirements

  • •BSEE or equivalent experience.
  • •Minimum 8+ years in board/system design.
  • •Understanding of transmission line theory, power delivery, and signal integrity.
  • •Experience with package design is preferred.
  • •Familiarity with Cadence tools and Excel; programming/scripting skills in Perl, Python, and/or Tcl are desired.
Experience:8+ years
Education:Bachelor's
Skills:Problem-solvingCommunicationProactive ownershipWorking independently
Tech Stack:PerlPythonTclCadenceExcel

Company Brief

NVIDIA
Designs and manufactures GPUs, AI accelerators, and system-on-chip products for gaming, data centers, professional visualization, and automotive markets, enabling advanced graphics, AI, and high-performance computing solutions worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1993
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