PDE CEM Engineer

Micron Technology
Gujarat
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 8+ yearsSkills: ["Problem-solving","Continuous improvement","Cross-functional collaboration","Data-driven decision-making","Coaching"]

Own and optimize semiconductor packaging assembly processes for new product introduction and ongoing business-case schedules. Drive NPI qualification and define process specifications, parameters, and tolerances. Use DOE, SPC, Six Sigma, and structured problem-solving (RCA/FMEA) to improve yield, reliability, and process margins. Leverage AI/ML, MES, and analytics for predictive control, anomaly detection, and process understanding. Collaborate across manufacturing, yield, equipment, and digital teams to enable scalable high-volume execution.

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FursaFursa
Micron Technology
Micron Technology
3 weeks ago

PDE CEM Engineer

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Last checked: 3 hours agoStatus: Live

Job Summary

Own and optimize semiconductor packaging assembly processes for new product introduction and ongoing business-case schedules. Drive NPI qualification and define process specifications, parameters, and tolerances. Use DOE, SPC, Six Sigma, and structured problem-solving (RCA/FMEA) to improve yield, reliability, and process margins. Leverage AI/ML, MES, and analytics for predictive control, anomaly detection, and process understanding. Collaborate across manufacturing, yield, equipment, and digital teams to enable scalable high-volume execution.
Location: Gujarat
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Own process of record (POR), process windows, capability (CPK), and NPI qualification with first-pass success.
  • •Define process specifications (parameters, tool setup, conditions, tolerances) and drive process optimization and control.
  • •Apply DOE, SPC, Six Sigma, and robust process centering to improve process capability and margins; develop a capability roadmap.
  • •Lead structured problem resolution (RCA, FMEA, OCAP), perform containment, and implement corrective/preventive actions to improve yield and reliability.
  • •Use AI/ML and MES/equipment/yield data to predict yield trends, detect early excursions, enable predictive control, and accelerate decision-making.

Key Requirements

  • •8+ years in semiconductor process development and backend assembly.
  • •Master’s or PhD in Mechanical, Chemical, Materials, Electrical Engineering.
  • •Strong expertise in assembly processes and packaging integration.
  • •Proficiency with DOE, SPC, FMEA, RCA, and Six Sigma, plus statistical analysis (JMP or equivalent).
  • •Working knowledge of data analytics/machine learning fundamentals; Python/SQL/analytics tools preferred.
Experience:8+ yearsSemiconductorBackend assemblyPackagingManufacturing
Education:
Skills:Problem-solvingContinuous improvementCross-functional collaborationData-driven decision-makingCoaching
Tech Stack:AI/MLAnalyticsPythonSQLJMPMESDOESPCSix SigmaFMEARCAIndustry 4.0Anomaly detectionPredictive controlAI-enabled dashboards

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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