2 months ago

Principal Member of Technical Staff, LCM Advanced Packaging & Manufacturing Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 9 hours agoStatus: Live

Job Summary

Seeking a Principal Member of Technical Staff in Taiwan to lead NPI and production management for semiconductor advanced packaging and test of optical devices. You will coordinate with wafer fabs, OSATs, LCOS assembly, and test vendors, drive schedules and supplier execution, travel to supplier sites, and guide manufacturing test and quality processes across a global supply base.

Location: Taipei

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

•Lead supplier engagement and project management across OSATs, LCOS assembly, optical sub-assembly, test vendors, and wafer fab partners to ensure on-time execution.
•Own NPI assembly process development for LCM-based optical modules and drive transitions from low-volume builds to scalable production.
•Define and qualify advanced packaging architectures (e.g., flip-chip, wafer-level, fan-out, CoC) and collect DFM feedback from suppliers.
•Serve as on-site production test interface, providing Level 1 troubleshooting and coordinating hardware/software interactions with Lumotive’s test team.
•Drive yield improvement, process optimization, cost reduction, and establish build readiness criteria for new processes, tooling, and suppliers.

Travel: High travel

Key Requirements

•Bachelor’s degree in Mechanical Engineering, Manufacturing Engineering, Materials Science, or a related field (MS/PhD or equivalent practical experience strongly preferred).
•12+ years of industry experience, including 10+ years in supplier-facing manufacturing, process, quality, or NPI engineering roles.
•Fluency in Mandarin and English is required.
•Proven experience in DFM and process design for opto-mechanical and opto-electronic systems.
•Strong background in semiconductor packaging, LCOS, or MEMS assembly, with a focus on optical subsystems.

Experience:SemiconductorOpticalManufacturingLCOSMEMS

Education:Bachelor's

Skills:Project managementLeadershipCommunicationProblem-solving

Languages:MandarinEnglish

Tech Stack:ArenaSolidWorksTableauJMPPLMMESSPCDFMWafer bondingAOIWire bonding

Company Brief

Lumotive

Develops solid-state LiDAR systems using programmable photonics and beam-steering technology to enable advanced sensing for automotive, robotics, and industrial applications.

Industry: Hardware Devices

Company Size: Medium (51 to 250 employees)

Growth: Growth Stage Startup

Headquarters: Seattle, United States

Founded: 2017

Website LinkedIn

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Lumotive

2 months ago

Principal Member of Technical Staff, LCM Advanced Packaging & Manufacturing Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 9 hours agoStatus: Live

Job Summary

Location: Taipei

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

•Lead supplier engagement and project management across OSATs, LCOS assembly, optical sub-assembly, test vendors, and wafer fab partners to ensure on-time execution.
•Own NPI assembly process development for LCM-based optical modules and drive transitions from low-volume builds to scalable production.
•Define and qualify advanced packaging architectures (e.g., flip-chip, wafer-level, fan-out, CoC) and collect DFM feedback from suppliers.
•Serve as on-site production test interface, providing Level 1 troubleshooting and coordinating hardware/software interactions with Lumotive’s test team.
•Drive yield improvement, process optimization, cost reduction, and establish build readiness criteria for new processes, tooling, and suppliers.

Travel: High travel

Key Requirements

•Bachelor’s degree in Mechanical Engineering, Manufacturing Engineering, Materials Science, or a related field (MS/PhD or equivalent practical experience strongly preferred).
•12+ years of industry experience, including 10+ years in supplier-facing manufacturing, process, quality, or NPI engineering roles.
•Fluency in Mandarin and English is required.
•Proven experience in DFM and process design for opto-mechanical and opto-electronic systems.
•Strong background in semiconductor packaging, LCOS, or MEMS assembly, with a focus on optical subsystems.

Experience:SemiconductorOpticalManufacturingLCOSMEMS

Education:Bachelor's

Skills:Project managementLeadershipCommunicationProblem-solving

Languages:MandarinEnglish

Tech Stack:ArenaSolidWorksTableauJMPPLMMESSPCDFMWafer bondingAOIWire bonding

Company Brief

Lumotive

Develops solid-state LiDAR systems using programmable photonics and beam-steering technology to enable advanced sensing for automotive, robotics, and industrial applications.

Industry: Hardware Devices

Company Size: Medium (51 to 250 employees)

Growth: Growth Stage Startup

Headquarters: Seattle, United States

Founded: 2017

Website LinkedIn