Cisco

3 months ago

Mechanical Engineering Technical Leader

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Lead mechanical and thermomechanical simulations for ASICs and complex silicon packages within Cisco’s ASIC Group. Drive FEA analysis to evaluate thermal-mechanical stress, warpage, and solder joint reliability; develop automated simulation workflows using Python or Fortran; collaborate with global teams to accelerate time-to-market while supporting design optimization and root-cause analysis with test data correlations.

Location: Taipei

Workplace: Hybrid

Employment Type: Full time

Job Function: Field Service, Maintenance & Skilled Trades

Key Responsibilities

•Perform finite element analysis to evaluate thermal mechanical stress, warpage, solder joint reliability of ASIC package, substrates, and advanced packaging assemblies.
•Simulate and analyze linear/nonlinear material behaviors, such as plasticity, creep, and viscoelasticity, relevant to solder joints, Copper, stiffener, and underfills.
•Develop and automate simulation workflows using Python, Fortran or similar scripting tools to streamline analysis and reporting.
•Provide clear simulation results to support mechanical design, root cause analysis, and risk mitigation.
•Support design optimization at early phase of product development and failure investigations by correlating FEA predictions with test data and field returns.

Key Requirements

•Bachelor's degree + 8 years of related experience, or Master's degree + 6 years of related experience, or PhD + 3 years of related experience.
•At least 3 years of experience in mechanical design and thermomechanical simulation of semiconductor packages.
•Hands-on experience with 3D modeling, finite element analysis using ABAQUS or ANSYS.
•Flexibility to coordinate and communicate across different time zones, supporting global project teams in the US and Asia.
•Proficiency in CAD, GD&T with AUTOCAD, CREO; knowledge of GD&T, design-for-reliability (DfR) principles and industry standards (JEDEC, IPC).

Experience:3+ yearsSemiconductorsElectronics packaging

Education:Bachelor's

Skills:CommunicationCollaborationProblem-solving

Tech Stack:ABAQUSANSYSPythonFortranAUTOCADCREOGD&T

Company Brief

Cisco

Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.

Industry: Networking Equipment

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: San Jose, United States

Founded: 1984

Glassdoor: 4.0

Website LinkedIn Glassdoor

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Cisco

3 months ago

Mechanical Engineering Technical Leader

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Location: Taipei

Workplace: Hybrid

Employment Type: Full time

Job Function: Field Service, Maintenance & Skilled Trades

Key Responsibilities

•Perform finite element analysis to evaluate thermal mechanical stress, warpage, solder joint reliability of ASIC package, substrates, and advanced packaging assemblies.
•Simulate and analyze linear/nonlinear material behaviors, such as plasticity, creep, and viscoelasticity, relevant to solder joints, Copper, stiffener, and underfills.
•Develop and automate simulation workflows using Python, Fortran or similar scripting tools to streamline analysis and reporting.
•Provide clear simulation results to support mechanical design, root cause analysis, and risk mitigation.
•Support design optimization at early phase of product development and failure investigations by correlating FEA predictions with test data and field returns.

Key Requirements

•Bachelor's degree + 8 years of related experience, or Master's degree + 6 years of related experience, or PhD + 3 years of related experience.
•At least 3 years of experience in mechanical design and thermomechanical simulation of semiconductor packages.
•Hands-on experience with 3D modeling, finite element analysis using ABAQUS or ANSYS.
•Flexibility to coordinate and communicate across different time zones, supporting global project teams in the US and Asia.
•Proficiency in CAD, GD&T with AUTOCAD, CREO; knowledge of GD&T, design-for-reliability (DfR) principles and industry standards (JEDEC, IPC).

Experience:3+ yearsSemiconductorsElectronics packaging

Education:Bachelor's

Skills:CommunicationCollaborationProblem-solving

Tech Stack:ABAQUSANSYSPythonFortranAUTOCADCREOGD&T

Company Brief

Cisco

Industry: Networking Equipment

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: San Jose, United States

Founded: 1984

Glassdoor: 4.0

Website LinkedIn Glassdoor