Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind)

Own the full lifecycle of advanced packaging for satellite compute electronics powering on-orbit AI inference. You’ll develop board assembly processes, drive materials selection and manufacturing ramp, and build supply chains for die, components, and consumables. Lead integrated thermal solutions (including next-gen TIMs) and qualification activities, collaborate with adjacent disciplines across hardware and supply chain, and mentor engineers while managing safety and environmental compliance risks.