Packaging Engineer (CPO)

AMD
Taiwan
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringEducation: bachelorsSkills: ["Communication","Leadership","Problem-solving"]

Lead the development of co-packaged optics (CPO) packaging from concept to production in a semiconductor context, guiding architecture definition, process standards (DFM/DFY), and cross-functional teams across geos. Focus on Si photonics-based optical engine packaging, connector ecosystems, and collaboration with foundries and OSATs to enable high-volume manufacturing. Strong emphasis on communication with AMD management and ecosystem partners.

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FursaFursa
AMD
AMD
8 months ago

Packaging Engineer (CPO)

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Last checked: 12 hours agoStatus: Live

Job Summary

Lead the development of co-packaged optics (CPO) packaging from concept to production in a semiconductor context, guiding architecture definition, process standards (DFM/DFY), and cross-functional teams across geos. Focus on Si photonics-based optical engine packaging, connector ecosystems, and collaboration with foundries and OSATs to enable high-volume manufacturing. Strong emphasis on communication with AMD management and ecosystem partners.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

  • •Define package architectures and roadmaps with product architects in early stages.
  • •Design multi-fiber optical connectors and coordinate with external vendors to build a connector ecosystem.
  • •Lead new package technology development initiatives including 2.5D and 3D packaging from concept to full technology qualification.
  • •Drive test vehicle design and manufacturing to establish design rules and DFM/DFY guidelines.
  • •Establish yield roadmaps and lead the implementation of yield/data analytics tools as needed.

Key Requirements

  • •BS/MS/PhD in Materials Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering, or equivalent
  • •proven track record delivering photonics/packaging solutions from concept to production
  • •experience driving engineering teams in architecture definition, process definition, and/or yield improvement
  • •strong oral and written communication skills to share complex information with partners and management
  • •experience with cross-functional collaboration across geos and with manufacturing partners (foundries/OSATs)
Experience:SemiconductorPhotonicsPackagingSi photonics
Education:Bachelor's
Skills:CommunicationLeadershipProblem-solving
Languages:English
Tech Stack:Si photonicsPackaging2.5D3D packagingDFMDFYHVMOSATFoundry

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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