Package Reliability Engineer

Micron Technology
Gujarat
Workplace: OnsiteFull timeFunction: Data Analytics & Business IntelligenceEducation: bachelorsSkills: ["Self-motivation","Independence","Attention to detail","Analytical problem-solving","Communication"]

Coordinate package qualification for new products and innovative builds by developing reliability test plans that assess risks such as excursions, conversions, and qualification issues. Lead root cause analysis and corrective actions for package-related qualification failures and RMAs within the Global Quality (GQ) department, preparing reports for review. Use reliability test data to support product release recommendations and help internal and external customers with package quality and reliability questions.

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FursaFursa
Micron Technology
Micron Technology
1 week ago

Package Reliability Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live

Job Summary

Coordinate package qualification for new products and innovative builds by developing reliability test plans that assess risks such as excursions, conversions, and qualification issues. Lead root cause analysis and corrective actions for package-related qualification failures and RMAs within the Global Quality (GQ) department, preparing reports for review. Use reliability test data to support product release recommendations and help internal and external customers with package quality and reliability questions.
Location: Gujarat
Workplace: Onsite
Employment Type: Full time
Job Function: Data Analytics & Business Intelligence
Seniority: Entry level

Key Responsibilities

  • •Coordinate package qualification for new products and innovative builds
  • •Develop reliability test plans to evaluate risk related to excursions, conversions, and qualification issues
  • •Perform root cause analysis and coordinate corrective actions for qualification failures and RMAs within the GQ department
  • •Prepare detailed reports for discussion and review
  • •Support internal and external customers with package-related quality and reliability concerns

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth Insurance

Key Requirements

  • •Minimum BS degree, M.Sc, or comparable engineering-related experience
  • •Detailed understanding of semiconductor component package assembly processes and challenges
  • •Understanding of surface mount methods and associated challenges
  • •Knowledge of thermomechanical/thermal/mechanical and hygroscopic swelling stresses affecting package reliability
  • •Practical understanding of reliability test techniques, acceleration models, and sampling statistics
Experience:SemiconductorsMicroelectronic packagingQuality/reliability engineeringFailure analysis
Education:Bachelor's
Skills:Self-motivationIndependenceAttention to detailAnalytical problem-solvingCommunication
Tech Stack:Microsoft CopilotGenieLLMAI agents

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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