3 months ago

TD Media and Collaterals Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Develops media and collaterals for semiconductor assembly processes, optimizing manufacturing efficiency and quality while applying DOE/SPC methods. Leads design and prototyping of media/tools, maintains evaluation equipment, and collaborates with packaging technology groups to advance product milestones.

Location: Phoenix

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Key Responsibilities

•Develops media and collaterals for assembly processes and equipment, applying novel concepts to enable Intel's future packaging technologies.
•Optimizes manufacturing efficiency and improves quality, cost, yield, productivity, and manufacturability of media and collaterals.
•Develops media and collateral specifications using design of experiments and data analysis, and documents improvements via white papers.
•Maintains equipment to evaluate media and collateral solutions under simulated field conditions (heat, humidity, vibration, temperature cycling, dynamic forces).
•Provides consultation on design problems and improvements in the assembly packaging process and coordinates with customer requests and events.

Pay and Benefits

Salary: USD 115,110 - 162,500 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Possess a BS/MS/PhD degree in Mechanical Engineering/Materials Engineering/Electrical Engineering/Physics or related field.
•Minimum 6 months of experience in fundamental science and engineering concepts with Design of Experiments (DOE) and Statistical Process Control (SPC).
•Strong mechanical design software experience (SolidWorks, AutoCAD, etc).
•Portfolio of self-completed project examples from concept to fabrication.
•Understanding of semiconductor fabrication processes and technology with technical and analytical skills.

Experience:2+ yearsSemiconductor manufacturing

Education:Bachelor's in Mechanical Engineering

Skills:Problem-solvingCommunicationTeamwork

Languages:English

Tech Stack:SolidWorksAutoCADSPCDOE

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

3 months ago

TD Media and Collaterals Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Location: Phoenix

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Key Responsibilities

•Develops media and collaterals for assembly processes and equipment, applying novel concepts to enable Intel's future packaging technologies.
•Optimizes manufacturing efficiency and improves quality, cost, yield, productivity, and manufacturability of media and collaterals.
•Develops media and collateral specifications using design of experiments and data analysis, and documents improvements via white papers.
•Maintains equipment to evaluate media and collateral solutions under simulated field conditions (heat, humidity, vibration, temperature cycling, dynamic forces).
•Provides consultation on design problems and improvements in the assembly packaging process and coordinates with customer requests and events.

Pay and Benefits

Salary: USD 115,110 - 162,500 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Possess a BS/MS/PhD degree in Mechanical Engineering/Materials Engineering/Electrical Engineering/Physics or related field.
•Minimum 6 months of experience in fundamental science and engineering concepts with Design of Experiments (DOE) and Statistical Process Control (SPC).
•Strong mechanical design software experience (SolidWorks, AutoCAD, etc).
•Portfolio of self-completed project examples from concept to fabrication.
•Understanding of semiconductor fabrication processes and technology with technical and analytical skills.

Experience:2+ yearsSemiconductor manufacturing

Education:Bachelor's in Mechanical Engineering

Skills:Problem-solvingCommunicationTeamwork

Languages:English

Tech Stack:SolidWorksAutoCADSPCDOE

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor