Intel

3 weeks ago

Senior Staff Process Engineer – Dry Etch

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Shape semiconductor manufacturing by driving dry-etch technology development and process integration for Intel Foundry’s MDCE team. You’ll lead feasibility studies, design and optimize manufacturing processes, and partner with equipment and material suppliers to improve output and device yield. The role includes hands-on dry-etch expertise for sub-3nm Gate-All-Around (GAA) FETs, plus collaboration with Logic Technology Development (LTD) and TFSM teams to support global foundry customer requirements.

Location: Phoenix

Workplace: Hybrid

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Sr. Manager level

Key Responsibilities

•Drive technology development initiatives that enable high-volume manufacturing and future technology advancement.
•Provide comprehensive process integration and equipment solutions, including feasibility studies to meet target device specifications.
•Lead design and development of manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
•Optimize production output for existing products and partner with equipment/material suppliers to develop enabling technology elements.
•Develop and mentor technical leaders while collaborating closely with LTD and TFSM teams to support customer requirements.

Pay and Benefits

Salary: USD 155,520 - 298,440 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Bachelor’s degree in Electrical Engineering, Physics, Materials Science, or a STEM field.
•6+ years of relevant semiconductor industry experience focused on dry etch modules.
•Experience in process development/semiconductor processing/materials, including dry etch tool supplier optimization or customization.
•Extensive fab experience with a technical track record such as R&D, yield improvement, or defect reduction.
•Preferred: advanced degree (MS/PhD) and hands-on experience with sub-3nm Gate-All-Around (GAA) FETs plus foundry NPI and tape-out troubleshooting.

Experience:6+ yearsSemiconductor industryDry etchFoundryHigh-volume manufacturingNPIFabProcess development

Education:Bachelor's in Electrical Engineering, Physics, Material Science (or STEM related)

Skills:Technical leadershipMentorshipStrategic thinkingCollaborationRoot cause analysis

Tech Stack:Dry etchSub-3nmGate-All-Around (GAA) FETsGAALAMTELAMATHitachiFEOLMOLBEOLDesign of Experiment (DOE)Theoretical simulationsEquipment metrologyParameter optimizationDevice parametric data generationNPITape-out troubleshootingFactory automation control systems

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

3 weeks ago

Senior Staff Process Engineer – Dry Etch

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Location: Phoenix

Workplace: Hybrid

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Sr. Manager level

Key Responsibilities

•Drive technology development initiatives that enable high-volume manufacturing and future technology advancement.
•Provide comprehensive process integration and equipment solutions, including feasibility studies to meet target device specifications.
•Lead design and development of manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
•Optimize production output for existing products and partner with equipment/material suppliers to develop enabling technology elements.
•Develop and mentor technical leaders while collaborating closely with LTD and TFSM teams to support customer requirements.

Pay and Benefits

Salary: USD 155,520 - 298,440 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Bachelor’s degree in Electrical Engineering, Physics, Materials Science, or a STEM field.
•6+ years of relevant semiconductor industry experience focused on dry etch modules.
•Experience in process development/semiconductor processing/materials, including dry etch tool supplier optimization or customization.
•Extensive fab experience with a technical track record such as R&D, yield improvement, or defect reduction.
•Preferred: advanced degree (MS/PhD) and hands-on experience with sub-3nm Gate-All-Around (GAA) FETs plus foundry NPI and tape-out troubleshooting.

Experience:6+ yearsSemiconductor industryDry etchFoundryHigh-volume manufacturingNPIFabProcess development

Education:Bachelor's in Electrical Engineering, Physics, Material Science (or STEM related)

Skills:Technical leadershipMentorshipStrategic thinkingCollaborationRoot cause analysis

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor