Intel

1 month ago

Principal Engineer, Hybrid Bonding Module

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 3 hours agoStatus: Live

Job Summary

Define and scale next-generation die-to-wafer hybrid bonding technologies for Intel’s advanced packaging roadmap. Lead module-level process development, equipment/platform FOK çalışmalar, and cross-functional collaboration to deliver manufacturable bonding solutions with high yield, reliability, and cost efficiency across multiple products and sites.

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Seniority: Sr. Manager level

Key Responsibilities

•Define and drive the hybrid bonding technology roadmap, including pitch scaling, alignment/overlay requirements, and yield, defectivity, and reliability targets aligned to future product needs.
•Lead module-level process development and execution for die-to-wafer hybrid bonding, ensuring robust, manufacturable solutions integrated across adjacent process steps (die prep, thinning, planarization).
•Drive first-of-a-kind (FOK) equipment and platform development, from concept through implementation, enabling next-generation bonding architectures and capabilities.
•Develop and implement strategies to address critical hybrid bonding challenges, including bond interface defects, alignment/overlay limitations, surface preparation and materials interactions, and defectivity reduction.
•Lead resolution of systemic yield and reliability issues using data-driven methodologies to drive improvements in process capability and manufacturability.

Pay and Benefits

Salary: USD 211,400 - 298,440 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Deep expertise in hybrid bonding, wafer bonding, or advanced packaging module development.
•Proven industry experience in hybrid bonding equipment development, process development, yield improvement, and reliability enhancement.
•Experience with first-of-a-kind (FOK) platform or equipment development and scaling to high-volume manufacturing (HVM).
•Ability to translate technology roadmaps into executable module strategies and identify process/equipment limitations.
•Experience mentoring and developing senior technical talent and strong communication/decision-making skills.

Experience:SemiconductorPackaging

Education:Bachelor's

Tech Stack:Hybrid bondingWafer bondingAdvanced packagingFOKHVMChiplets

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

1 month ago

Principal Engineer, Hybrid Bonding Module

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 3 hours agoStatus: Live

Job Summary

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Seniority: Sr. Manager level

Key Responsibilities

•Define and drive the hybrid bonding technology roadmap, including pitch scaling, alignment/overlay requirements, and yield, defectivity, and reliability targets aligned to future product needs.
•Lead module-level process development and execution for die-to-wafer hybrid bonding, ensuring robust, manufacturable solutions integrated across adjacent process steps (die prep, thinning, planarization).
•Drive first-of-a-kind (FOK) equipment and platform development, from concept through implementation, enabling next-generation bonding architectures and capabilities.
•Develop and implement strategies to address critical hybrid bonding challenges, including bond interface defects, alignment/overlay limitations, surface preparation and materials interactions, and defectivity reduction.
•Lead resolution of systemic yield and reliability issues using data-driven methodologies to drive improvements in process capability and manufacturability.

Pay and Benefits

Salary: USD 211,400 - 298,440 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Deep expertise in hybrid bonding, wafer bonding, or advanced packaging module development.
•Proven industry experience in hybrid bonding equipment development, process development, yield improvement, and reliability enhancement.
•Experience with first-of-a-kind (FOK) platform or equipment development and scaling to high-volume manufacturing (HVM).
•Ability to translate technology roadmaps into executable module strategies and identify process/equipment limitations.
•Experience mentoring and developing senior technical talent and strong communication/decision-making skills.

Experience:SemiconductorPackaging

Education:Bachelor's

Tech Stack:Hybrid bondingWafer bondingAdvanced packagingFOKHVMChiplets

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor