Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunitySkills: ["Execution ownership","Structured troubleshooting","Cross-functional collaboration","Technical communication","Mentoring"]

Own module/sub-module portions of NAND advanced thin films process development, delivering robustness, capability, and integration readiness. Develop, optimize, and characterize CVD/diffusion dielectric and carbon film processes; execute experiments and translate data into scalable process improvements. Drive issue resolution within scope, correlate material/structural/electrical results with integration and device teams, support tool qualifications/transfers, and communicate findings through clear reporting and mentoring.

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FursaFursa
Micron Technology
Micron Technology
3 months ago

Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND

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Source: Company careers pageValidated by: Fursa AI
Last checked: 17 hours agoStatus: Live

Job Summary

Own module/sub-module portions of NAND advanced thin films process development, delivering robustness, capability, and integration readiness. Develop, optimize, and characterize CVD/diffusion dielectric and carbon film processes; execute experiments and translate data into scalable process improvements. Drive issue resolution within scope, correlate material/structural/electrical results with integration and device teams, support tool qualifications/transfers, and communicate findings through clear reporting and mentoring.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets.
  • •Execute well-designed experiments, analyze data, and translate results into process improvements; support scaling across nodes and platforms.
  • •Own defined portions of a process module/sub-module under senior guidance, tracking margins, sensitivities, and integration risks.
  • •Correlate material, structural, and electrical data with integration and device needs; support failure analysis and root-cause investigations.
  • •Support tool/hardware engagement for dielectric/carbon film equipment (tool qualifications, upgrades, transfers) and communicate results through reports and reviews.

Key Requirements

  • •PhD (≥3 years), or Master’s (≥5 years), or Bachelor’s (≥7 years) in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related fields
  • •Demonstrated thin film R&D / process development experience linking process conditions to material properties and device behavior
  • •Strong thin film deposition fundamentals for CVD/Diffusion and thin film materials/chemistry/process physics
  • •Familiarity with fab metrology and thin film characterization methods (structural/mechanical/optical/electrical as applicable)
  • •Working knowledge of plasma processes, vacuum systems, and chemical reactions
Experience:Thin film R&DProcess developmentSemiconductorsNAND
Skills:Execution ownershipStructured troubleshootingCross-functional collaborationTechnical communicationMentoring

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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