Applications Engineer - Automotive Connectivity

Texas Instruments
Shanghai
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 3+ yearsEducation: bachelorsSkills: ["Communication","Presentation","Analytical thinking","Problem-solving","Collaboration"]

Support automotive customers as they design, ramp, and manufacture products using TI connectivity solutions. Work with Tier 1s and OEMs on wireless application design for Car Access, TPMS, and WBMS (Bluetooth Low Energy and TI WBMS Protocol), providing technical support, debugging, and design reviews. Collaborate with systems, hardware, and software teams to implement custom firmware features and create demos, documentation, and training while traveling to customer sites as needed.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Texas Instruments
Texas Instruments
9 months ago

Applications Engineer - Automotive Connectivity

âś“ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 9 hours agoStatus: Live

Job Summary

Support automotive customers as they design, ramp, and manufacture products using TI connectivity solutions. Work with Tier 1s and OEMs on wireless application design for Car Access, TPMS, and WBMS (Bluetooth Low Energy and TI WBMS Protocol), providing technical support, debugging, and design reviews. Collaborate with systems, hardware, and software teams to implement custom firmware features and create demos, documentation, and training while traveling to customer sites as needed.
Location: Shanghai
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Work with Automotive Tier 1s and OEMs to design and implement next-generation wireless connectivity applications for Car Access, TPMS, and WBMS.
  • •Provide high-volume technical customer support in collaboration with Sales/FAE, including on-site support for critical engagements.
  • •Partner with systems and engineering teams during early design activities for new products and translate customer requirements into technical specifications.
  • •Collaborate with hardware and software teams to implement custom features in firmware and build/design/document/test application hardware/software solutions.
  • •Create technical collateral (application notes, documentation, trainings, webinars) and develop end-equipment demonstrations for OEMs/Tier 1s to showcase TI value proposition.
Travel: Medium travel

Key Requirements

  • •Bachelor’s degree in Engineering, Business, or a related field.
  • •3+ years of experience with embedded programming and wireless communication, preferably in Bluetooth, automotive, or semiconductor.
  • •Proficiency with programming in C, C++, and (as a plus) Python.
  • •Experience supporting embedded RTOS products (e.g., TI-RTOS, FreeRTOS) and debugging embedded applications.
  • •Strong English communication and presentation skills, including ability to present complex technical information to executive audiences.
Experience:3+ yearsAutomotiveSemiconductorEmbedded programmingWireless connectivityBluetoothRTOSCustomer-facing
Education:Bachelor's in Electrical Engineering, Computer Engineering (or related field)
Skills:CommunicationPresentationAnalytical thinkingProblem-solvingCollaboration
Languages:English
Tech Stack:Bluetooth Low EnergyBluetoothWi-FiTI WBMS ProtocolZigbeeThreadProprietary protocolsSPIUARTI2CCANCAN-FDLINCC++PythonEmbedded programmingEmbedded RTOSTI-RTOSFreeRTOS

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn