Staff Design Engineer/Architect, HBM

Micron Technology
Texas, United States
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 4+ yearsEducation: bachelorsSkills: ["Cross-functional collaboration","Root cause analysis","Systems problem-solving"]

Architect and design high-speed datapath circuitry for next-generation High Bandwidth Memory (HBM) logic-die and core-die solutions. Define system specifications and I/O processes to ensure hardware/software compatibility, coordinate subsystem integration across design, PHY, ECC, verification, layout, and systems groups, and support development through silicon bring-up. Diagnose system/program deficiencies and drive corrective actions to improve datapath performance for JEDEC and custom HBM solutions.

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FursaFursa
Micron Technology
Micron Technology
4 weeks ago

Staff Design Engineer/Architect, HBM

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Architect and design high-speed datapath circuitry for next-generation High Bandwidth Memory (HBM) logic-die and core-die solutions. Define system specifications and I/O processes to ensure hardware/software compatibility, coordinate subsystem integration across design, PHY, ECC, verification, layout, and systems groups, and support development through silicon bring-up. Diagnose system/program deficiencies and drive corrective actions to improve datapath performance for JEDEC and custom HBM solutions.
Location: Texas, United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Architect, design, and optimize logic-die and core-die datapath circuitry for next-generation HBM products.
  • •Determine system specifications, input/output processes, and working parameters for hardware/software compatibility.
  • •Coordinate subsystem design and integration across multi-functional teams.
  • •Identify, analyze, and resolve system or program support deficiencies.
  • •Develop and recommend corrective actions to ensure robust datapath performance.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field with 4 years of relevant industry experience.
  • •Experience architecting, designing, or optimizing high-speed datapath circuitry.
  • •Ability to define and implement complex system requirements, identify issues, analyze root causes, and recommend corrective actions.
  • •Experience determining hardware/software system specifications and I/O processes.
  • •Experience coordinating subsystem design and system integration activities.
Experience:4+ yearsSemiconductorHardware designMemory and storageHigh-speed datapathHBMJEDEC
Education:Bachelor's in Electrical Engineering, Computer Engineering, or related field
Skills:Cross-functional collaborationRoot cause analysisSystems problem-solving
Tech Stack:HBMHigh Bandwidth MemoryJEDECCADCircuit designLogic-dieCore-dieDatapath circuitryLayoutVerificationPHYECCI/O processesSilicon bring-up

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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