Thermal Mechanical Test Engineer, Silicon Packaging (Starlink)

SpaceX
United States
Workplace: OnsiteFull timeFunction: QA, Test & Release EngineeringExperience: 1+ yearsEducation: bachelorsSkills: []

Develop and execute thermal and mechanical modeling and test programs for advanced semiconductor packaging and board-level assemblies. Characterize package and board thermal performance, validate mechanical robustness, and correlate simulation results with physical test data to support high-volume production of reliable Starlink hardware. Design and run finite element models and thermal simulations, build test campaigns, operate test equipment, and provide actionable feedback across packaging, silicon design, manufacturing, production, and quality teams.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
SpaceX
SpaceX
2 months ago

Thermal Mechanical Test Engineer, Silicon Packaging (Starlink)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 13 hours agoStatus: Live

Job Summary

Develop and execute thermal and mechanical modeling and test programs for advanced semiconductor packaging and board-level assemblies. Characterize package and board thermal performance, validate mechanical robustness, and correlate simulation results with physical test data to support high-volume production of reliable Starlink hardware. Design and run finite element models and thermal simulations, build test campaigns, operate test equipment, and provide actionable feedback across packaging, silicon design, manufacturing, production, and quality teams.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: QA, Test & Release Engineering
Seniority: Entry level

Key Responsibilities

  • •Develop and run thermal and mechanical finite element models and thermal simulations to predict package and board behavior under operational and environmental conditions.
  • •Develop process models to support new production line bring-up and packaging process investigations.
  • •Design, set up, and execute thermal and mechanical test campaigns.
  • •Perform board-level thermal characterization and testing to evaluate heat spreading, junction temperatures, and system-level thermal performance.
  • •Operate and maintain thermal/mechanical test equipment and instrumentation; analyze test data, correlate models with test results, and share actionable feedback to cross-functional teams.

Key Requirements

  • •Bachelor’s degree in an engineering, math, or science discipline.
  • •1+ years of experience with thermal or mechanical modeling and testing in an industry or academic setting.
  • •Experience with board-level thermal testing and characterization (e.g., thermocouple mapping, power dissipation testing, infrared thermography).
  • •Experience using finite element analysis or thermal simulation tools such as ANSYS, Abaqus, COMSOL, Flotherm, or Icepak.
  • •Ability to work extended hours or weekends as needed for mission-critical deadlines.
Experience:1+ yearsSemiconductor packagingHigh-reliability electronicsIC packagingHigh-volume manufacturingNew product introduction
Education:Bachelor's
Languages:English
Tech Stack:Finite element analysisThermal simulationANSYSAbaqusCOMSOLFlothermIcepakPythonMATLABThermocouplesInfrared camerasThermal chambersInfrared thermography

Eligibility

Nationality:US National

Company Brief

SpaceX
Designs, manufactures, and launches advanced rockets and spacecraft for commercial and government customers, aiming to reduce space transportation costs and enable human life on Mars through reusable launch vehicles and integrated space systems.
Industry: Aerospace Manufacturing
Company Size: Enterprise (1,001+ employees)
Growth: Established Company
Valuation: Hectocorn (USD 100B+)
Funding: Series E+
Headquarters: Hawthorne, United States
Founded: 2002
Glassdoor
Glassdoor: 4.2
WebsiteLinkedIn