Thermal Mechanical Test Engineer, Silicon Packaging (Starlink)

Develop and execute thermal and mechanical modeling and test programs for advanced semiconductor packaging and board-level assemblies. Characterize package and board thermal performance, validate mechanical robustness, and correlate simulation results with physical test data to support high-volume production of reliable Starlink hardware. Design and run finite element models and thermal simulations, build test campaigns, operate test equipment, and provide actionable feedback across packaging, silicon design, manufacturing, production, and quality teams.