AMD

1 month ago

Manager Packaging Engineering

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Last checked: 6 hours agoStatus: Live

Job Summary

Lead a team of engineers responsible for InFO, CoWoS, WLFO, and chiplet packaging manufacturing readiness, driving yield, quality, and cost improvements. Own technical direction, standardization across sites and suppliers, and cross-functional collaboration to ensure successful NPI, ramp, and ongoing manufacturing excellence in a fast-paced semiconductor environment.

Location: Kaohsiung

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Manager level

Key Responsibilities

•Provide leadership for a team of engineers responsible for InFO, EFB/CoWoS-L, CoWoS-S, WLFO, FCBGA, LGA, and chiplet package manufacturing readiness for new product bring-up at manufacturing sites.
•Own team execution for packaging yield, quality, cost, and operational productivity improvement and sustaining activities.
•Define technical direction and drive assembly process baseline standardization and continuous improvement across supported manufacturing sites and suppliers.
•Oversee packaging interaction activities across assembly, bump, 3D IC, HBM, wafer fab, wafer sort, functional test, and mark/pack to ensure aligned execution and issue resolution.
•Partner with assembly manufacturers to enhance process, equipment, and material capability for future-generation technology products.

Key Requirements

•15+ years of experience in InFO or 2.5D/3D bump/TSV/packaging with hands-on experience in assembly manufacturing operations
•Deep knowledge of InFO, chiplet packaging, 2.5D/3D TSV/packaging, Flip Chip BGA/LGA processes, and chip-package interaction
•Demonstrated experience leading and scaling engineering teams, including coaching, performance management, and development of technical talent
•Minimum 5 years of experience in supplier management, including performance management, issue escalation, and stakeholder engagement
•Familiarity with DOE, JMP, and data-driven problem-solving methodologies

Experience:15+ yearsSemiconductorPackagingManufacturing

Education:Bachelor's

Skills:LeadershipCommunicationCross-functional collaborationProblem-solvingStrategic thinking

Languages:English

Tech Stack:DOEJMP

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

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AMD