Package Health Yield (Senior/Staff/Principal) Engineer, APTD

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceExperience: 2+ yearsEducation: mastersSkills: ["Problem-solving","Multitasking","Communication"]

Develop and execute package health monitoring, simulation, and characterization for advanced high-performance memory packaging. Define and optimize wafer- and die-level test architecture, coverage, and yield targets, then perform electrical characterization and failure analysis. Create and improve DFTs with cross-functional teams, enhance fail debugging for probe yield, and support APTD product roadmap and test vehicle validation readiness with internal and external partners.

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FursaFursa
Micron Technology
Micron Technology
3 weeks ago

Package Health Yield (Senior/Staff/Principal) Engineer, APTD

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Source: Company careers pageValidated by: Fursa AI
Last checked: 17 hours agoStatus: Live

Job Summary

Develop and execute package health monitoring, simulation, and characterization for advanced high-performance memory packaging. Define and optimize wafer- and die-level test architecture, coverage, and yield targets, then perform electrical characterization and failure analysis. Create and improve DFTs with cross-functional teams, enhance fail debugging for probe yield, and support APTD product roadmap and test vehicle validation readiness with internal and external partners.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Mid level

Key Responsibilities

  • •Develop advanced packaging technology strategies focused on test architecture, coverage, and yield.
  • •Define, validate, and optimize test coverage for wafer and die level processes.
  • •Perform electrical characterization and failure analysis of advanced packages including HBM.
  • •Identify and co-develop new DFTs with cross-functional teams and enhance fail debugging to meet probe yield targets.
  • •Contribute to the APTD product roadmap from the test architecture perspective and support test vehicle validation readiness and customer test flow readiness.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical Engineering (or related field).
  • •2+ years of experience in the semiconductor industry working on complex products, preferably in product, packaging, or test engineering.
  • •Experience defining test architectures, coverage, and managing test/probe yield.
  • •Strong knowledge of product testing, test architecture, and packaging fail modes.
  • •Hands-on experience with simulation tools and test equipment for package characterization and electrical failure analysis.
Experience:2+ yearsSemiconductor industryAI/ML
Education:Master's in Electrical Engineering
Skills:Problem-solvingMultitaskingCommunication
Tech Stack:PythonMATLABJMP

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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