Product Yield Enhancement Engineer, HBM

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 2+ yearsEducation: bachelorsSkills: ["Cross-functional collaboration","Report writing","Data analysis"]

Investigate and improve HBM product yield by performing electrical failure analysis and fault isolation across production test, internal qualification, and customer returns (RMA). Use emission microscopy, laser-based methods, EOTPR, and physical failure analysis/de-processing to identify root causes tied to fabrication or assembly. Model failure signatures from backend testing data, collaborate across Product, Process, Assembly, Quality, and Management, and use AI-assisted workflows to accelerate root-cause determination, including swing/night shifts as needed.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
3 days ago

Product Yield Enhancement Engineer, HBM

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Investigate and improve HBM product yield by performing electrical failure analysis and fault isolation across production test, internal qualification, and customer returns (RMA). Use emission microscopy, laser-based methods, EOTPR, and physical failure analysis/de-processing to identify root causes tied to fabrication or assembly. Model failure signatures from backend testing data, collaborate across Product, Process, Assembly, Quality, and Management, and use AI-assisted workflows to accelerate root-cause determination, including swing/night shifts as needed.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Perform electrical failure analysis and fault isolation using emission microscopy, laser-based methods, and EOTPR.
  • •Analyze and model failure signatures using backend testing, qualification, and RMA data.
  • •Apply physical failure analysis (PFA) and de-processing to isolate defects.
  • •Generate clear failure analysis reports with root cause and corrective action insights.
  • •Collaborate cross-functionally to communicate findings, drive resolution, and accelerate root-cause determination using AI-assisted tools; support swing or night shifts as required.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid Leave

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Computer Engineering, Physics, Chemistry, or equivalent practical experience.
  • •2+ years of semiconductor industry experience in yield engineering, fault isolation, or failure analysis.
  • •Experience with computer-aided design (CAD), including layout and schematic analysis.
  • •Strong understanding of semiconductor device physics and VLSI design principles.
  • •Proficiency in scripting within UNIX/Linux environments (e.g., Tcl, Bash, Shell).
Experience:2+ yearsSemiconductorYield engineeringFailure analysis
Education:Bachelor's in Electrical Engineering; Materials Science; Computer Engineering; Physics; Chemistry
Skills:Cross-functional collaborationReport writingData analysis
Tech Stack:HBMHigh bandwidth memoryElectrical failure analysisFault isolationEmission microscopyLaser-based methodsEOTPRPhysical failure analysisDe-processingCMOSFinFETDevice physicsVLSICADLayout analysisSchematic analysisUNIXLinuxTclBash

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn