Applied Materials

1 day ago

Director, Advanced Packaging Disruptive Technology

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 20 hours agoStatus: Live

Job Summary

Define and drive long-range pathfinding strategy for N+2 and beyond advanced packaging technologies, leading disruptive innovation from exploratory, pre-product concepts into scalable solutions. Build and lead a high-impact innovation team covering D2W, RDL, CoWoS, TSV and related approaches, translating customer roadmaps and market inflections into actionable strategies. Establish incubation and governance frameworks, align engineering/product/business units, and co-develop with an ecosystem of suppliers and research partners.

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Executive & General Management

Seniority: Director level

Key Responsibilities

•Define and execute long-range (N+2 and beyond) pathfinding roadmaps for advanced packaging, identifying next inflection points in integration, interconnect, materials, and architectures.
•Lead concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms.
•Evaluate emerging technology options and guide make/buy/partner decisions to build differentiated capability ahead of adoption cycles.
•Build and lead a pathfinding and innovation team, creating frameworks for idea generation, incubation, rapid prototyping, and down-selection while mentoring leaders.
•Translate customer roadmaps and market inflections into actionable technology development strategies and drive ecosystem co-innovation and strategic partnerships.

Travel: Medium travel

Key Requirements

•15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.
•Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
•Strong understanding of advanced packaging technologies such as D2W, RDL, CoWoS, and TSV, with ability to go beyond existing paradigms.
•Proven experience building and leading cross-functional or exploratory R&D teams.
•Ability to translate complex technology concepts into business impact and strategic direction.

Experience:15+ yearsSemiconductor technologyAdvanced packagingR&DExploratory technology

Education:Master's in Materials Science, Electrical Engineering, Mechanical Engineering, Physics

Skills:LeadershipInnovation mindsetStrategic thinkingCollaborationDecision-making

Tech Stack:Advanced packagingD2WRDLCoWoSTSVIntegration architecturesHeterogeneous integrationChiplet ecosystemsAIHPCMemory integrationInterconnectMaterials scienceRapid prototypingMake/buy/partner decisions

Company Brief

Applied Materials

Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor

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Applied Materials

1 day ago

Director, Advanced Packaging Disruptive Technology

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 20 hours agoStatus: Live

Job Summary

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Executive & General Management

Seniority: Director level

Key Responsibilities

•Define and execute long-range (N+2 and beyond) pathfinding roadmaps for advanced packaging, identifying next inflection points in integration, interconnect, materials, and architectures.
•Lead concept incubation and feasibility exploration for disruptive packaging approaches beyond existing platforms.
•Evaluate emerging technology options and guide make/buy/partner decisions to build differentiated capability ahead of adoption cycles.
•Build and lead a pathfinding and innovation team, creating frameworks for idea generation, incubation, rapid prototyping, and down-selection while mentoring leaders.
•Translate customer roadmaps and market inflections into actionable technology development strategies and drive ecosystem co-innovation and strategic partnerships.

Travel: Medium travel

Key Requirements

•15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.
•Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
•Strong understanding of advanced packaging technologies such as D2W, RDL, CoWoS, and TSV, with ability to go beyond existing paradigms.
•Proven experience building and leading cross-functional or exploratory R&D teams.
•Ability to translate complex technology concepts into business impact and strategic direction.

Experience:15+ yearsSemiconductor technologyAdvanced packagingR&DExploratory technology

Education:Master's in Materials Science, Electrical Engineering, Mechanical Engineering, Physics

Skills:LeadershipInnovation mindsetStrategic thinkingCollaborationDecision-making

Company Brief

Applied Materials

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor