Staff HBM Design Architect - DFT

Micron Technology
United States
Workplace: OnsiteFull timeUSD 146,000 - 297,000 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 5+ yearsEducation: mastersSkills: ["Collaboration","Debugging","Technical problem-solving","Quality focus"]

Define and implement end-to-end DFT architectures for HBM products, shaping how stacked-die, cube-level, and system-level test flows validate next-generation memory from wafer to final test. Partner with design, verification, layout, test, and manufacturing teams to architect test access mechanisms, enable silicon observability for yield learning and failure analysis, and improve quality, yield, and performance across complex multi-die systems.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

Staff HBM Design Architect - DFT

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Define and implement end-to-end DFT architectures for HBM products, shaping how stacked-die, cube-level, and system-level test flows validate next-generation memory from wafer to final test. Partner with design, verification, layout, test, and manufacturing teams to architect test access mechanisms, enable silicon observability for yield learning and failure analysis, and improve quality, yield, and performance across complex multi-die systems.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Define and implement end-to-end DFT architectures for HBM base die and DRAM die.
  • •Develop DFT strategies for stacked-die, cube-level, and system-level test flows.
  • •Architect test access mechanisms supporting wafer probe through final test.
  • •Enable silicon observability for yield learning, debug, and failure analysis.
  • •Collaborate across design, verification, layout, test, and manufacturing teams to deliver reliable test architectures.

Pay and Benefits

Salary: USD 146,000 - 297,000 annually
Perks:Health InsuranceDentalVisionParental LeavePaid Time-offPaid Holidays

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
  • •Strong knowledge of scan, MBIST, JTAG, and boundary scan concepts.
  • •Experience with wafer probe and final test semiconductor flows.
  • •5+ years of experience in DRAM or ASIC DFT design or verification.
Experience:5+ years
Education:Master's
Skills:CollaborationDebuggingTechnical problem-solvingQuality focus
Tech Stack:DFTHBMDRAMASICScanMBISTJTAGBoundary scanWafer probeFinal testStacked-dieCube-levelSystem-level testTest access mechanismsSilicon observabilityYield learningFailure analysisTSV-based 3D integrationAt-speed testDFT security features

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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