LFAB Cu Plating Process Engineer

Drive the technology ramp for LFAB’s latest 28nm (and below) analog/embedded wafer manufacturing, working as part of the factory engineering team. Own process sustainment, development, and transfer activities, including lot and equipment dispositions, equipment/process startup, and process experiments (SWRs). Improve efficiencies, yields, quality, and machine operations through updated methods and project plans, while performing data analysis and problem resolution and supporting 28nm CMOS planar technology.