Sr. Member Technical Staff - ESD and Latch-Up - HBM

Micron Technology
United States
Workplace: OnsiteFull timeUSD 177,000 - 334,000 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 10+ yearsEducation: mastersSkills: ["Technical leadership","Cross-functional collaboration","Problem-solving"]

Define end-to-end ESD and latch-up protection architecture for next-generation HBM across advanced nodes and 3D integration. You’ll develop protection strategies for base die, DRAM stacks, and interconnects, set ESD/LUP standards and signoff criteria, and drive correlation between design assumptions and silicon validation. Partner with foundry and packaging teams to solve system-level ESD challenges, influencing technical direction from early architecture through validation.

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Micron Technology
Micron Technology
1 month ago

Sr. Member Technical Staff - ESD and Latch-Up - HBM

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Last checked: 21 hours agoStatus: Live

Job Summary

Define end-to-end ESD and latch-up protection architecture for next-generation HBM across advanced nodes and 3D integration. You’ll develop protection strategies for base die, DRAM stacks, and interconnects, set ESD/LUP standards and signoff criteria, and drive correlation between design assumptions and silicon validation. Partner with foundry and packaging teams to solve system-level ESD challenges, influencing technical direction from early architecture through validation.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Define end-to-end ESD and latch-up architecture across base die, DRAM die, and interconnects
  • •Develop protection strategies for high-speed I/O, TSV interfaces, and advanced packaging
  • •Establish ESD/LUP standards, rule decks, and signoff criteria
  • •Drive correlation between design assumptions, silicon validation, and field reliability
  • •Partner with foundry and packaging teams on system-level ESD challenges

Pay and Benefits

Salary: USD 177,000 - 334,000 annually
Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •MS or PhD in Electrical Engineering or related field, or equivalent practical experience
  • •10+ years of experience in ESD and latch-up design and reliability
  • •Expertise in advanced CMOS technologies such as FinFET or GAA
  • •Experience with 3D IC, TSV, or die-to-die interfaces
  • •Experience debugging silicon failures related to ESD or latch-up
Experience:10+ yearsHBMSemiconductors3D ICESD and latch-up reliability
Education:Master's
Skills:Technical leadershipCross-functional collaborationProblem-solving
Tech Stack:FinFETGAA3D ICTSVDie-to-die interfacesBase dieDRAM stacksInterconnectsAdvanced packaging

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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