Global Product Support (GPS) Engineer - Advanced Packaging

Applied Materials
Santa Clara
Workplace: OnsiteFull timeUSD 124,000 - 171,000Function: Communications, PR & CommunityEducation: bachelorsSkills: ["Troubleshooting","Root-cause analysis","Communication"]

Support installation, startup, qualification, and ongoing operation of the Kinex™ Hybrid Bonding platform for CTO advanced packaging development programs. Serve as the primary equipment support engineer to take the system from installation through process readiness, coordinating with Facilities, BESI, Applied product engineering teams, and CTO process development. Drive installation and startup activities, facilities integration, equipment troubleshooting and reliability improvements, and vendor/product engineering engagement. Enable hybrid bonding, optical interconnect, and heterogeneous integration development.

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FursaFursa
Applied Materials
Applied Materials
5 days ago

Global Product Support (GPS) Engineer - Advanced Packaging

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 19 hours agoStatus: Live

Job Summary

Support installation, startup, qualification, and ongoing operation of the Kinex™ Hybrid Bonding platform for CTO advanced packaging development programs. Serve as the primary equipment support engineer to take the system from installation through process readiness, coordinating with Facilities, BESI, Applied product engineering teams, and CTO process development. Drive installation and startup activities, facilities integration, equipment troubleshooting and reliability improvements, and vendor/product engineering engagement. Enable hybrid bonding, optical interconnect, and heterogeneous integration development.
Location: Santa Clara
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Support Kinex installation activities from tool dock through release to engineering users.
  • •Coordinate Tier 0, Tier 1, and Tier 2 startup activities and drive closure of installation punch-list items.
  • •Develop recovery plans, and support factory acceptance and site acceptance with vendors.
  • •Troubleshoot mechanical, electrical, automation, and process-related issues; develop preventative maintenance procedures; analyze reliability trends and lead root-cause investigations.
  • •Serve as primary technical interface with BESI and Kinex product engineering teams to coordinate reviews, service/upgrades, manage escalations, and support engineering changes and new capabilities.
Travel: Low travel

Pay and Benefits

Salary: USD 124,000 - 171,000

Key Requirements

  • •BS in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering, or related engineering discipline.
  • •3–7 years of engineering experience in semiconductor equipment (new college graduates not considered).
  • •Experience supporting semiconductor manufacturing or development equipment.
  • •Strong troubleshooting and root-cause analysis skills.
  • •Excellent verbal and written communication skills, with ability to work across facilities, vendors, process engineering, and operations teams.
Experience:Semiconductor equipmentSemiconductor manufacturing
Education:Bachelor's in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering
Skills:TroubleshootingRoot-cause analysisCommunication
Tech Stack:KinexHybrid BondingAdvanced packagingDie-to-wafer hybrid bondingOptical interconnectHybrid bonding process developmentBESIVacuum systemsPlasma processing systemsMetrology systemsWet processing equipmentAutomated material handling systems300 mm equipment

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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