Senior Technologist, Hybrid Bonding Module
Intel
United States
Workplace: OnsiteFull timeUSD 180,770 - 255,200 annuallyFunction: Solutions Engineering & Sales EngineeringEducation: phdSkills: ["DOE","Statistical analysis","Metrology","Defect inspection","Failure analysis","Process characterization","Equipment development","Alignment","Bonding","Manufacturing"]Senior technologist leading die-to-wafer hybrid bonding process/equipment development for next-generation packaging, enabling Intel’s AI-ready chiplet platforms. Drives first-of-a-kind platform development, DOE-based experimentation, yield/reliability improvements, and collaboration across technology development and manufacturing to advance hybrid bonding roadmaps.
