Senior Technologist, Hybrid Bonding Module

Intel
United States
Workplace: OnsiteFull timeUSD 180,770 - 255,200 annuallyFunction: Solutions Engineering & Sales EngineeringExperience: 4+ yearsSkills: ["Structured problem-solving","Written and verbal communication","Cross-functional collaboration","Mentoring","Prioritization"]

Drive process and/or equipment development for die-to-wafer hybrid bonding to advance next-generation hybrid bonding technologies. Lead first-of-a-kind capability development and optimize manufacturing processes to improve yield, reliability, and defectivity. Work on bond interface quality, alignment, overlay accuracy, and contamination control using DOE experiments, statistical analysis, and process feasibility studies. Partner with suppliers and collaborate across technology and manufacturing teams to mature process platforms and technology roadmaps.

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Intel
Intel
3 months ago

Senior Technologist, Hybrid Bonding Module

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 10 hours agoStatus: Live
Reposted: similar role first listed 1 month ago

Job Summary

Drive process and/or equipment development for die-to-wafer hybrid bonding to advance next-generation hybrid bonding technologies. Lead first-of-a-kind capability development and optimize manufacturing processes to improve yield, reliability, and defectivity. Work on bond interface quality, alignment, overlay accuracy, and contamination control using DOE experiments, statistical analysis, and process feasibility studies. Partner with suppliers and collaborate across technology and manufacturing teams to mature process platforms and technology roadmaps.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Drive process and/or equipment development for die-to-wafer hybrid bonding, including material selection, parameter optimization, equipment characterization, and process control.
  • •Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
  • •Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
  • •Design and execute DOE-based experiments and conduct statistical analysis to establish robust process windows and control strategies.
  • •Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.

Pay and Benefits

Salary: USD 180,770 - 255,200 annually
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field with 9+ years of experience; OR a Master’s degree with 6+ years; OR a PhD with 4+ years.
  • •5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging, or closely related semiconductor manufacturing technologies.
  • •Experience leading first-of-a-kind (FOK) process or equipment development programs.
  • •Knowledge of bond interface defect mechanisms including void formation, adhesion challenges, contamination effects, and material interactions.
  • •Experience with process characterization, metrology, defect inspection, or failure analysis techniques.
Experience:4+ yearsSemiconductor manufacturingAdvanced packagingAI hardwareChiplets
Education:
Skills:Structured problem-solvingWritten and verbal communicationCross-functional collaborationMentoringPrioritization

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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