Staff/Principal Engineer, APTD CEM - Advanced Packaging Integration Engineering

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 7+ yearsSkills: ["Analytical","Problem-solving","Communication","Leadership","Cross-functional collaboration"]

Develop and enable advanced semiconductor packaging technologies for post-fab wafer finish and assembly processes, improving product quality, yield, cost, and productivity. Drive yield and quality breakthroughs through data collection/analysis and collaboration with probe, yield analysis, test, and product engineering teams. Establish correlations and advanced controls to improve defect/defense coverage, provide POR/MOR documentation, and integrate AI-assisted tools into day-to-day work.

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Micron Technology
Micron Technology
6 days ago

Staff/Principal Engineer, APTD CEM - Advanced Packaging Integration Engineering

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live

Job Summary

Develop and enable advanced semiconductor packaging technologies for post-fab wafer finish and assembly processes, improving product quality, yield, cost, and productivity. Drive yield and quality breakthroughs through data collection/analysis and collaboration with probe, yield analysis, test, and product engineering teams. Establish correlations and advanced controls to improve defect/defense coverage, provide POR/MOR documentation, and integrate AI-assisted tools into day-to-day work.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop and enable advanced package technology for various post-fab wafer finish and assembly processes.
  • •Drive yield improvements using silicon package integration innovation, supported by data analysis for actionable outcomes.
  • •Ensure quality improvements by establishing defense coverage through process, measurement, inspection, and testing, and identifying improvement opportunities via correlations.
  • •Collaborate with internal/external stakeholders and cross-functional teams to build and execute technology development strategies and integration flows.
  • •Provide Process Of Record (POR) and Model Of Record (MOR) documentation to support product transfer from new product development to high volume manufacturing.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth Insurance

Key Requirements

  • •PhD (≥2 years) or Master’s (≥5 years) or Bachelor’s (≥7 years) in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related fields.
  • •Semiconductor process integration experience, including developing and enabling advanced package technology for post-fab wafer finish and assembly processes.
  • •Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
  • •Experience with Visual Basic for automation and tool integration.
  • •Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
Experience:7+ yearsSemiconductorProcess integrationAdvanced packaging
Education:
Skills:AnalyticalProblem-solvingCommunicationLeadershipCross-functional collaboration
Tech Stack:PythonRSQLVisual BasicE3FDCRMSSPCDOEAI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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