Mixed-signal Design Architect, HBM Architecture

Micron Technology
United States
Workplace: OnsiteFull timeUSD 146,000 - 297,000 annuallyFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsSkills: []

Design next-generation 3D-stacked high-bandwidth memory (HBM) architectures for AI workloads, partnering with peer architecture and design teams. You’ll design, simulate, and optimize analog and mixed-signal circuits; architect power delivery and on-/off-chip interfaces; and perform timing, area, power, and complexity tradeoff analysis. You’ll also drive thermal management improvements, future-generation pathfinding, and maintain clear architecture documentation.

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Micron Technology
Micron Technology
1 week ago

Mixed-signal Design Architect, HBM Architecture

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Last checked: 3 hours agoStatus: Live

Job Summary

Design next-generation 3D-stacked high-bandwidth memory (HBM) architectures for AI workloads, partnering with peer architecture and design teams. You’ll design, simulate, and optimize analog and mixed-signal circuits; architect power delivery and on-/off-chip interfaces; and perform timing, area, power, and complexity tradeoff analysis. You’ll also drive thermal management improvements, future-generation pathfinding, and maintain clear architecture documentation.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Design, optimize, and simulate critical analog and/or mixed-signal circuits for high-performance memory.
  • •Architect power delivery for high-performance stacked memories and evaluate related tradeoffs.
  • •Analyze, specify, and prototype on-/off-chip interfaces.
  • •Perform timing, area, power, and complexity analysis to support low-power architectures.
  • •Define architectures to improve thermal management and maintain clear architecture documentation.

Pay and Benefits

Salary: USD 146,000 - 297,000 annually
Perks:MedicalDentalVisionPaid Leave

Key Requirements

  • •Experience with analog and/or mixed-signal design, including simulation and floorplanning.
  • •Hands-on transistor-level simulation (e.g., FineSim, HSPICE) with corner analysis.
  • •Ability to analyze architecture tradeoffs and translate findings into specifications.
  • •Experience with power delivery analysis, tradeoffs, constraints, and related challenges.
  • •5+ years delivering mixed-signal circuit designs, 3D-stacked memory/logic, or complex packaging architectures.
Experience:5+ years3D-stacked memoryHBMMixed-signal design
Education:
Tech Stack:FineSimHSPICEPythonPerlVerilogDRAMHBM

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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