Package Architect – Advanced Packaging & System Exploration

Micron Technology
San Jose, Boise
Workplace: OnsiteFull timeUSD 177,000 - 387,000 annuallyFunction: Hardware, Embedded & Systems EngineeringExperience: 10+ yearsEducation: bachelorsSkills: ["Independent execution","Analytical thinking","Communication"]

Drive early-phase exploration of advanced semiconductor package concepts by building, modeling, and simulating architectures for future memory and system products. Perform package-level trade studies across signal integrity (SI), power integrity (PI), thermals, cost, and scalability, then translate results into clear architectural guidance. Define package requirements, act as extension architecture/engineering, and independently generate feasibility conclusions through hands-on design and simulation work.

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Micron Technology
Micron Technology
3 months ago

Package Architect – Advanced Packaging & System Exploration

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Source: Company careers pageValidated by: Fursa AI
Last checked: 15 hours agoStatus: Live

Job Summary

Drive early-phase exploration of advanced semiconductor package concepts by building, modeling, and simulating architectures for future memory and system products. Perform package-level trade studies across signal integrity (SI), power integrity (PI), thermals, cost, and scalability, then translate results into clear architectural guidance. Define package requirements, act as extension architecture/engineering, and independently generate feasibility conclusions through hands-on design and simulation work.
Location: San Jose, Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Define and explore advanced package architectures for future memory systems.
  • •Perform package-level trade-off studies across SI, PI, thermals, cost, and scalability.
  • •Build hands-on package designs and models for early feasibility analysis.
  • •Run SI/PI and thermal simulations and translate results into architecture guidance.
  • •Define package requirements and act as extension architecture and engineering.

Pay and Benefits

Salary: USD 177,000 - 387,000 annually
Perks:Health InsuranceDentalVisionPaid LeavePaid Holidays

Key Requirements

  • •Bachelor’s degree or equivalent practical experience in EE, ME, Materials, or a related field.
  • •10+ years of hands-on experience in package design or package-level simulation.
  • •Strong experience with package SI modeling and analysis.
  • •Independently build models and drive conclusions.
  • •Experience supporting architecture or pre-silicon exploration teams (preferred).
Experience:10+ yearsSemiconductorMemoryAdvanced packagingPre-silicon exploration
Education:Bachelor's
Skills:Independent executionAnalytical thinkingCommunication
Tech Stack:SI modelingSI analysisPIThermal simulationsPackage-level trade studiesMulti-die integrationHeterogeneous integration

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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