Packaging Engineer

AMD
Taiwan
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringEducation: phdSkills: ["Communication","Cross-functional collaboration"]

Lead advanced substrate technology development and supply chain bring-up to support the product roadmap. Define substrate and board technology directions (pitch scaling, power delivery, signal integrity, and cost), partner with architects and product owners on high-yield, cost-effective solutions, and qualify substrates for new products. Coordinate with product, quality, and manufacturing engineering from concept through NPI to hit manufacturability, yield, and reliability milestones.

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FursaFursa
AMD
AMD
1 day ago

Packaging Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 11 hours agoStatus: Live

Job Summary

Lead advanced substrate technology development and supply chain bring-up to support the product roadmap. Define substrate and board technology directions (pitch scaling, power delivery, signal integrity, and cost), partner with architects and product owners on high-yield, cost-effective solutions, and qualify substrates for new products. Coordinate with product, quality, and manufacturing engineering from concept through NPI to hit manufacturability, yield, and reliability milestones.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Lead technology development and supply chain bring-up for advanced substrate technologies supporting the product roadmap.
  • •Define an advanced substrate/board technology roadmap across pitch scaling, power delivery, signal integrity, and cost.
  • •Partner with architects, designers, and product owners to develop high-yield, cost-effective substrate solutions that meet product requirements.
  • •Select development partners and build AMD supply chain capability for industry-leading substrate and PCB technology building blocks.
  • •Partner with product, quality, and manufacturing engineering to achieve milestones for manufacturability, yield, and reliability from concept through NPI, and qualify package substrates for new products.

Key Requirements

  • •Proven track record developing advanced packaging technologies at a substrate supplier, OSAT, or Fabless/IDM, including identifying and enabling new substrates.
  • •Hands-on experience in new process development with deep knowledge of packaging and board design rules.
  • •Strong understanding of process flows and materials for advanced packaging/substrate work.
  • •Excellent oral and written communication skills to align technology target requirements with suppliers and internal partners.
  • •MS or PhD in Physics, Chemistry, Material science, Chemical engineering (or equivalent).
Education:PhD / Doctorate in Physics, Chemistry, Material science, Chemical engineering (or equivalent)
Skills:CommunicationCross-functional collaboration
Languages:English
Tech Stack:Substrate technologiesOSATFabless/IDMPCBBoard design rulesProcess developmentNPI

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn